Chucking method and processing method using the same
View Patent ↗The invention provides an electrostatically chucking technology capable of chucking a workpiece formed of an insulator or a workpiece attached with an object to be processed such as a semiconductor wafer on a stage. A layered body attached with a glass substrate for supporting a semiconductor substrate having an electronic device on its surface is prepared, and a conductive film is attached thereto. Then, the layered body is set on a surface of a stage set in a vacuum chamber such as a dry-etching apparatus. After then, a voltage is applied to an internal electrode to generate positive and negative electric charges on the surfaces of the conductive film and the stage, and the layered body is chucked with static electricity generated therebetween. Then, the layered body chucked on the stage is processed by etching, CVD, or PVD.
1. A method of chucking, comprising:
providing an object comprising a surface portion that is made of an insulator;
attaching a member comprising a conductive layer to the surface portion using an adhesive;
placing the object to which the member is attached in a vacuum chamber; and
chucking the object to which the member is attached to a stage provided in the vacuum chamber by generating electrostatic charges between the member and the stage.
2. The method of claim 1 , wherein the insulator comprises a glass, a ceramic, quartz, a plastic, or a resin.
3. The method of claim 1 , wherein the member further comprises a protection layer and an adhesive layer.
4. The method of claim 1 , wherein the member further comprises a protection layer, a polyimide layer and an adhesive layer.
5. The method of claim 1 , wherein the member further comprises a protection layer, a polymer layer formed by polymerizing a conductive material and polyimide, and an adhesive layer.
6. The method of claim 1 , wherein the member comprises a conductive resin layer.
7. A method of chucking, comprising:
providing an object for chucking;
attaching a substrate made of an insulator to the object;
attaching a member comprising a conductive layer to the substrate after the attaching of the substrate to the object;
placing the object to which the member and the substrate are attached in a vacuum chamber; and
chucking the object to which the member and the substrate are attached to a stage provided in the vacuum chamber by generating electrostatic charges between the member and the stage.
8. The method of claim 7 , wherein the insulator comprises a glass, a ceramic, quartz, a plastic, or a resin.
9. The method of claim 7 , wherein the member further comprises a protection layer and an adhesive layer.
10. The method of claim 7 wherein the member further comprises a protection layer, a polyimide layer and an adhesive layer.
11. The method of claim 7 , wherein the member further comprises a protection layer, a polymer layer formed by polymerizing a conductive material and polyimide, and an adhesive layer.
12. The method of claim 7 , wherein the object comprises a semiconductor wafer,an insulator or a conductor.
13. The method of claim 7 , wherein the member comprises a conductive resin layer.
14. A method of processing objects, comprising:
providing an object comprising a surface portion that is made of an insulator;
attaching a member comprising a conductive layer to the surface portion using an adhesive;
placing the object to which the member is attached in a vacuum chamber;
chucking the object to which the member is attached to a stage provided in the vacuum chamber by generating electrostatic charges between the member and the stage; and
processing the object chucked to the stage in the vacuum chamber.
15. The method of claim 14 , wherein the insulator comprises a glass, a ceramic, quartz, a plastic, or a resin.
16. The method of claim 14 , wherein the processing of the chucked object comprises a dry-etching, a chemical vapor deposition or physical vapor deposition.
17. The method of claim 14 , wherein the member further comprises a protection layer and an adhesive layer.
18. The method of claim 14 , wherein the member further comprises a protection layer, a polyimide layer and an adhesive layer.
19. The method of claim 14 , wherein the member further comprises a protection layer, a polymer layer formed by polymerizing a conductive material and polyimide, and an adhesive layer.
20. The method of claim 14 , wherein the member comprises a conductive resin layer.
21. A method of processing an object, comprising:
attaching a substrate made of an insulator to the object;
attaching a member comprising a conductive layer to the substrate, after the attaching of the substrate to the object;
placing the object to which the member and the substrate are attached in a vacuum chamber;
chucking the object to which the member and the substrate are attached to a stage provided in the vacuum chamber by generating electrostatic charges between the member and the stage; and
processing the object chucked to the stage in the vacuum chamber.
22. The method of claim 21 , wherein the insulator comprises a glass, a ceramic, quartz, a plastic, or a resin.
23. The method of claim 21 , wherein the processing of the chucked object comprises a dry-etching, a chemical vapor deposition or physical vapor deposition.
24. The method of claim 21 , wherein the member further comprises a protection layer and an adhesive layer.
25. The method of claim 21 , wherein the member further comprises a protection layer, a polyimide layer and an adhesive layer.
26. The method of claim 21 , wherein the member further comprises a protection layer, a polymer layer formed by polymerizing a conductive material and polyimide, and an adhesive layer.
27. The method of claim 21 , wherein the object comprises a semiconductor wafer, an insulator or a conductor.
28. The method of claim 21 , wherein the member comprises a conductive resin layer.
29. The method of claim 1 , further comprising:
processing the object chucked to the stage in the vacuum chamber, and
removing the member from the surface portion of the object after the processing of the object.
30. The method of claim 7 , further comprising:
processing the object chucked to the stage in the vacuum chamber, and
removing the member from the substrate after the processing of the object.
31. The method of claim 14 , further comprising:
removing the member from the surface portion of the object after the processing of the object.
32. The method of claim 21 , further comprising:
removing the member from the substrate after the processing of the object.