Method of manufacturing semiconductor device
View Patent ↗The method of manufacturing the semiconductor device includes the steps of forming terminal portions convexly protruding on a surface of first conductive foil by etching the first conductive foil except portions to become terminals, superimposing a resin sheet on the first conductive foil such that the terminal portions are embedded in the resin sheet, constructing a laminated sheet by superimposing second conductive foil having a resin layer formed on a back thereof, on the resin sheet with the resin layer faced down, forming a conductive pattern by etching the second conductive foil, electrically connecting the conductive pattern and the terminal portions, electrically isolating the terminal portions from each other, firmly fixing a semiconductor element to the laminated sheet and electrically connecting the semiconductor element and the conductive pattern, and forming sealing resin on a surface of the laminated sheet such that the semiconductor element is covered by the sealing resin.
1. A method of manufacturing a semiconductor device, comprising:
forming terminal portions convexly protruding on a surface of first conductive foil by etching the first conductive foil except portions to become terminals;
superimposing a resin on the first conductive foil such that the terminal portions are embedded in a resin sheet;
constructing a laminated sheet by superimposing second conductive foil on the resin sheet;
forming a conductive pattern by etching the second conductive foil;
electrically connecting the conductive pattern and the terminal portions;
electrically isolating the terminal portions from each other;
fixing a semiconductor element to the laminated sheet and electrically connecting the semiconductor element and the conductive pattern; and
forming sealing resin on a surface of the laminated sheet such that the semiconductor element is covered by the sealing resin.
2. The method according to claim 1 , wherein the terminal portions are electrically isolated from each other by etching the first conductive foil from a back thereof.
3. The method according to claim 1 , wherein the resin sheet is made of soluble resin, and the terminal portions are exposed by removing the resin sheet.
4. The method according to claim 1 , wherein the semiconductor element is fixed face-up, and an electrode of the semiconductor element and the conductive pattern are connected through a fine metallic wire.
5. The method according to claim 1 , wherein the semiconductor element is mounted face-down, and an electrode of the semiconductor element and the conductive pattern are connected through a bump electrode.