Light emitting diode lamp module
An LED lamps module is provided. The LED lamp module includes a plurality of LED lamps, a plurality of electric wires and a plurality of moisture-resisting members. In one embodiment of the present invention, each LED lamp includes a substrate with a circuit, at least one LED chip disposed on the substrate and connected with the circuitry electrically, a plurality of pins connected with the circuitry of the substrate electrically, and an encapsulant encapsulating the substrate, the LED chip and a portion of each pin. The electric wires are connected with the pins exposed. The moisture-resisting members encapsulat the pins exposed and a portion of each electric wire.
1. A light emitting diode (LED) lamp module, comprising a plurality of LED lamps, wherein each LED lamp comprises:
a substrate with a circuit;
at least one LED chip disposed on the substrate and connected with the circuit electrically;
a plurality of pins connected with the circuit of the substrate electrically;
an encapsulant encapsulating the substrate, the LED chip and a portion of each pin;
a plurality of electric wires connected with the exposed portion of the pins not surrounded by the encapsulant; and
a moisture-resisting member, encapsulating the bottom of the encapsulant, the exposed portion of the pins of the LED lamp and a portion of each of the plurality of electric wires.
2. An LED lamp module according to claim 1 , wherein at least one LED lamp is a full-colored LED lamp.
3. An LED lamp module according to claim 1 , wherein the LED chips, disposed on the substrate, comprise a red LED chip, a green LED chip and a blue LED chip.
4. An LED lamp module according to claim 1 , wherein the LED lamp has two pins or four pins.
5. An LED lamp module according to claim 1 , wherein each LED lamp further comprises a plurality of bonding wires connected between the LED chips and the circuit electrically.
6. An LED lamp module according to claim 1 , wherein each substrate has a first surface and a second surface, wherein the LED chip is disposed on the first surface, and the pins are protruded from the second surface.
7. An LED lamp module according to claim 6 , wherein each LED lamp further comprises a control integrated circuit disposed on the first surface or the second surface of the substrate, wherein each control integrated circuit is encapsulated by one of the encapsulants.
8. An LED lamp module according to claim 7 , further comprising an electrostatic protection circuit integrated in each control integrated circuit.
9. An LED lamp module according to claim 1 , further comprising an electrostatic protection circuit integrated in each circuit of the substrate.
10. An LED lamp module according to claim 1 , further comprising a solder material, wherein the electric wires and the pins are welded together with the solder material, and the solder material is encapsulated by the moisture-resisting members.
11. An LED lamp module according to claim 1 , wherein each electric wire comprises:
an insulating layer; and
a conductive wire wrapped in the insulating layer, wherein an end of the conductive wire are exposed from the insulating layer, and the exposed end of the conductive wire is connected with one of the pins.
12. An LED lamp module according to claim 1 , wherein the moisture-resisting members comprises plastics.