IP Library Granted Patent US 7,170,144
Granted Patent B2
US 7,170,144 · App. 10/906,583 · Granted Jan 30, 2007

System-on-chip with shield rings for shielding functional blocks therein from electromagnetic interference

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Quick Facts
Patent No.
US 7,170,144
App. No.
10/906,583
Granted
Jan 30, 2007
Kind
B2
Abstract

A system-on-chip (SoC) that is immune to electromagnetic interference has block shield rings fabricated therein. The SoC includes a microprocessor core; an on-chip bus interface; an embedded memory block; and an analog/mixed-signal integrated circuit shielded by an EMI shield ring encircling the analog/mixed-signal integrated circuit for protecting the analog/mixed-signal integrated circuit from electromagnetic interference. The EMI shield ring is grounded and includes a metal rampart consisting of multi-layer metals and vias. A pickup diffusion is connected to the metal rampart. In one embodiment, the memory block is also shielded.

Claims (17)

1. A system-on-chip comprising:

a microprocessor core;

an on-chip bus interface;

an embedded memory block; and

an analog/mixed-signal integrated circuit shielded by a first shield ring encircling said analog/mixed-signal integrated circuit for protecting said analog/mixed-signal integrated circuit from electromagnetic interference, wherein said first shield ring comprises a metal rampart consisting of multi-layer metals and vias, and said metal rampart has an analog/digital (A/D) connection window that allows digital-to-analog communication, wherein a signal line passes through said A/D connection window.

2. The system-on-chip of claim 1 wherein said metal rampart is connected to a pickup diffusion implanted into a substrate.

3. The system-on-chip of claim 2 wherein said substrate is a silicon-on-insulator (SOI) substrate.

4. The system-on-chip of claim 1 wherein said signal line is accompanied with two adjacent grounded lines which are formed at the same metal layer as said signal line.

5. The system-on-chip of claim 1 wherein said first shield ring is grounded.

6. The system-on-chip of claim 1 wherein said embedded memory block is shielded by a grounded second shield ring encircling said embedded memory block.

7. The system-on-chip of claim 1 further comprising a digital signal processor (DSP) block.

8. The system-on-chip of claim 1 further comprising an MPEG decoder.

9. A system-on-chip comprising:

a microprocessor core;

an on-chip bus interface;

an embedded memory block; and

an RF signal integrated circuit shielded by a shield ring encircling said RF signal integrated circuit for protecting said RF signal integrated circuit from electromagnetic interference, wherein said shield ring comprises a metal rampart consisting of multi-layer metals and vias, and said metal rampart has an analog/digital (A/D) connection window that allows digital-to-analog communication, wherein a signal line passes through said A/D connection window.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2021
From: UNITED MICROELECTRONICS CORPORATION
To: MARLIN SEMICONDUCTOR LIMITED
Reel/Frame 056991/0292 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2005
From: HSU, YU-HAO
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 015704/0532 →