IP Library Granted Patent US 7,238,611
Granted Patent B2
US 7,238,611 · App. 10/907,710 · Granted Jul 3, 2007

Salicide process

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Quick Facts
Patent No.
US 7,238,611
App. No.
10/907,710
Granted
Jul 3, 2007
Kind
B2
Abstract

A salicide process is provided. A metal layer selected from a group consisting of titanium, cobalt, platinum, palladium and an alloy thereof is formed over a silicon layer. A first thermal process is performed. Next, a second thermal process is performed, wherein the second thermal process includes a first step performed at 600˜700 degrees centigrade for 10˜60 seconds and a second step performed at 750˜850 degrees centigrade for 10˜60 seconds. If the metal layer is selected from a group consisting of nickel and an alloy thereof is formed on a silicon layer, the first step of the second thermal process is performed at 300˜400 degrees centigrade for 10˜60 seconds and the second step of the second thermal process is performed at 450˜550 degrees centigrade for 10˜60 seconds.

Claims (12)

1. A salicide process, comprising:

forming a metal layer over a silicon layer, wherein the metal layer is selected from a group consisting of titanium, cobalt, platinum, palladium and an alloy thereof;

performing thermal process for the metal layer to react with the silicon layer to form a metal silicide;

performing a selective etching to remove the nonreactive metal layer;

performing a nucleation thermal process at 600˜700 degrees centigrade for 10˜60 seconds; and

performing a grain growing thermal process at 750˜850 degrees centigrade for 10˜60 seconds.

2. The salicide process according to claim 1 , wherein the nucleation thermal process is performed at 630˜670 degrees centigrade for 20˜40 seconds.

3. The salicide process according to claim 1 , wherein the grain growing thermal process is performed at 780˜820 degrees centigrade for 20˜40 seconds.

4. The salicide process according to claim 1 , wherein the thermal process is a one-step thermal process.

5. The salicide process according to claim 4 , wherein the one-step thermal process performed at 450˜550 degrees centigrade for 10˜60 seconds.

6. The salicide process according to claim 1 , wherein the nucleation thermal process and the grain growing thermal process is a rapid thermal annealing process, respectiverly.

7. The salicide process according to claim 1 , wherein the thermal process is a rapid thermal annealing process.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2021
From: UNITED MICROELECTRONICS CORPORATION
To: MARLIN SEMICONDUCTOR LIMITED
Reel/Frame 056991/0292 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2005
From: CHEN, MIN-HSIAN; HSIEH, CHING-HSING
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 015893/0579 →