Chip package having chip extension and method
View Patent ↗A chip package including a chip extension for containing thermal interface material (TIM) and improves chip cooling, and a related method, are disclosed. In particular, the chip package includes a chip, a cooling structure coupled to the chip via a TIM, and a chip extension may be thermally coupled to an outer edge of the chip. A TIM placed between the chip and the cooling structure is contained during thermal cycling by the chip extension such that void formation at the edge of the chip, which can move between the chip and cooling structure, is suppressed. The chip extension also improves lateral heat dissipation by providing a greater thermal contact area between the cooling structure and the chip and, if needed, the substrate at a much lower cost than using larger die with lower production unit output from a wafer.
1. A chip package comprising:
a chip;
a cooling structure directly coupled to the chip via a compliant thermal interface material; and
a chip extension thermally coupled and laterally adhered to at least one outer side surface of the chip, wherein the chip extension includes at least two discontinuous portions, further wherein a surface of the chip adjacent to the cooling structure and a surface of the chip extension adjacent to the cooling structure are co-planar.
2. The chip package of claim 1 , wherein the chip extension is thermally conductive.
3. The chip package of claim 1 , wherein the chip extension is coupled to the cooling structure via the thermal interface material.
4. The chip package of claim 1 , wherein the chip extension includes a shape feature adjacent to a lower surface of the chip.
5. The chip package of claim 1 , wherein an outer edge of the chip extension is ramped.
6. The chip package of claim 1 , further comprising an adhesive filled region between the chip and the chip extension.
7. The chip package of claim 1 , wherein the chip extension includes at least one of the following: silicon, copper, aluminum, copper-molybdenum, graphite, aluminum-silicon-carbide, tungsten carbide, aluminum nitride, beryllia, and diamond based composites.
8. A chip package comprising:
a substrate;
a chip mounted to the substrate;
a cooling structure directly coupled to the chip via a compliant thermal interface material; and
a thermally conductive chip extension thermally coupled and laterally adhered to at least one outer side surface of the chip and to the substrate, the chip extension also thermally coupled to the cooling structure via the thermal interface material, wherein the chip and the chip extension are co-planar, further wherein the chip extension includes at least two discontinuous portions.
9. The chip package of claim 8 , wherein the chip extension includes a shape feature adjacent to a lower surface of the chip.
10. The chip package of claim 8 , wherein an outer edge of the chip extension is ramped.
11. The chip package of claim 8 , further comprising an adhesive filled region between the chip and the chip extension.
12. The chip package of claim 8 , wherein the chip extension includes at least one of the following: silicon, copper, aluminum, copper-molybdenum, graphite, aluminum-silicon-carbide, tungsten carbide, aluminum nitride, beryllia, and diamond based composites.