Defect detection method
View Patent ↗A defect detection method is disclosed, in which the method includes: providing a semiconductor sample, wherein the semiconductor sample comprises at least one defect; utilizing a failure analysis for detecting at least one suspected area on the backside of the semiconductor sample; utilizing a physical energy for forming a plurality of reference marks around the suspected area on the backside of the semiconductor sample; and utilizing the reference marks for determining the relative location of the defect on the front side of the semiconductor sample.
1. A defect detection method comprising:
providing a semiconductor sample, wherein the semiconductor sample comprises at least one defect;
utilizing a failure analysis for detecting at least one suspected area on one first surface of the semiconductor sample;
utilizing at least one first physical energy for forming a plurality of reference marks around the suspected area on the first surface of the semiconductor sample; and
utilizing the reference marks for determining the relative location of the defect on one second surface of the semiconductor sample.
2. The defect detection method of claim 1 , wherein the semiconductor sample comprises a semiconductor wafer, die, or chip.
3. The defect detection method of claim 1 , wherein the failure analysis comprises a hot spot analysis, an IR OBIRCH analysis, or an emission analysis.
4. The defect detection method of claim 3 , wherein the failure analysis generates a suspected signal respective to the location of the defect on the first surface of the semiconductor sample for further determining the location of the suspected area.
5. The defect detection method of claim 1 , wherein the first physical energy is a laser beam.
6. The defect detection method of claim 1 , wherein the step of determining the relative location of the defect on the second surface of the semiconductor sample is achieved by calculating abnormal voltage contrast results.
7. The defect detection method of claim 1 , wherein the step of determining the relative location of the defect on the second surface of the semiconductor sample is achieved by utilizing a laser beam.
8. The defect detection method of claim 1 , wherein after the step of determining the relative location of the defect on the second surface of the semiconductor sample is completed, the method further comprises an examining step.
9. The defect detection method of claim 8 , wherein the examining step further comprises utilizing an optical microscope, a scanning electron microscope, a transmission electron microscope, or a focused ion beam microscope for examining the second surface of the semiconductor sample.
10. The defect detection method of claim 9 , wherein the examining step further comprises a physical or chemical delayer process for determining the location of the defect.