Silicon carbide with high thermal conductivity
A chemical vapor deposited, β phase polycrystalline silicon carbide having a high thermal conductivity and reduced stacking faults. The silicon carbide is synthesized under specific conditions using hydrogen gas and methyltrichlorosilane gas as reactants. The thermal conductivity of the silicon carbide is sufficiently high such that it can be employed as parts of apparatus and components of electrical devices where a high heat load is generated. Such components may include active thermoelectric coolers, heat sinks and fans.
1. A chemical vapor deposited, freestanding β phase polycrystalline silicon carbide comprising stacking faults and a crystalline order ratio of 0.01 to 0.10.
2. The chemically vapor deposited, freestanding β phase polycrystalline silicon carbide of claim 1 , wherein the thermal conductivity ranges from about 375 W/mK to about 390 W/mK.
3. The chemically vapor deposited, freestanding β phase polycrystalline silicon carbide of claim 2 , wherein the thermal conductivity is less than about 389 W/mK.
4. The chemically vapor deposited, freestanding β phase polycrystalline silicon carbide of claim 1 , wherein the crystalline order ratio is from about 0.05 to about 0.01.
5. The chemical vapor deposited, freestanding β phase polycrystalline silicon carbide of claim 1 , further comprising a phonon mean free path of about 50 nm to 100 nm.
6. The chemical vapor deposited, freestanding β phase polycrystalline silicon carbide of claim 5 , wherein the phonon mean free path is from about 75 nm to about 90 nm.
7. The chemical vapor deposited, freestanding β phase polycrystalline silicon carbide of claim 1 , further comprising a silicon carbide grain size of from about 5 microns to about 20 microns.
8. The chemical vapor deposited, freestanding β phase polycrystalline silicon carbide of claim 1 , further comprising a thermal conductivity of at least 375 W/mK.