IP Library Granted Patent US 7,246,954
Granted Patent B2
US 7,246,954 · App. 10/915,202 · Granted Jul 24, 2007

Opto-electronic housing and optical assembly

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Quick Facts
Patent No.
US 7,246,954
App. No.
10/915,202
Granted
Jul 24, 2007
Kind
B2
Abstract

An opto-electronic housing and an opto-electronic assembly. The housing includes an enclosure defining a cavity. An opening through a wall of the enclosure is adapted to receive a substrate. A mount projects into the cavity opposite the opening. The mount is adapted to support an opto-electronic device. Adjacent the mount is an optically transmissive region in a wall of the enclosure. An opto-electronic assembly also includes a substrate disposed in the opening and an opto-electronic device supported by the mount.

Claims (21)

1. An opto-electronic housing comprising:

an enclosure defining a cavity and an exterior;

an opening through a wall of the enclosure and adapted to receive a substrate from the exterior for providing an electrical interface with an opto-electronic device in the cavity;

a mount projecting into the cavity opposite the first opening and adapted to support an opto-electronic device, wherein the mount projects into the cavity through a second opening in a wall of the enclosure; and

an optically transmissive region in a wall of the enclosure adjacent the mount, the optically transmissive region for communicating light between the opto-electronic device and the exterior.

2. An opto-electronic housing as in claim 1 wherein the mount is integrally formed with a wall of the enclosure.

3. An opto-electronic housing as in claim 1 and further comprising a heat sink in thermal communication with the mount and disposed outside the enclosure.

4. An opto-electronic housing as in claim 3 wherein the heat sink comprises a heat-dissipating plate.

5. An opto-electronic housing as in claim 4 wherein the heat-dissipating plate is substantially planar with an outside surface of the enclosure.

6. An opto-electronic housing as in claim 1 wherein the optically transmissive region comprises an opening.

7. An opto-electronic housing as in claim 1 wherein the optically transmissive region comprises a lens.

8. An opto-electronic housing as in claim 1 and further comprising a receptacle connected to the enclosure over the optically transmissive region and adapted to receive an optical fiber ferrule.

9. An opto-electronic assembly as in claim 1 wherein the enclosure comprises a plurality of walls and a sealant that seals a gap between adjacent ones of the walls.

10. An opto-electronic assembly comprising:

an opto-electronic housing as in claim 1 ;

a substrate carrying a plurality of electrical conductors, the substrate disposed in the opening and extending into the cavity; and

an opto-electronic device supported by the mount and in electrical communication with the electrical conductors.

11. An opto-electronic assembly as in claim 10 wherein an extremity of the substrate is notched to straddle the mount.

12. An opto-electronic assembly as in claim 10 wherein an extremity of the substrate defines an opening to receive the mount.

13. An opto-electronic assembly as in claim 10 and further comprising a rail on an interior surface of the cavity defining a channel to receive the substrate.

14. An opto-electronic assembly as in claim 10 and further comprising a sealant that seals a gap between the substrate and the first opening.

Assignments (13)
MERGER Recorded Mar 3, 2023
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED; BROADCOM INTERNATIONAL PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 062952/0850 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047196 FRAME: 0097. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048555/0510 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0097 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 017206 FRAME: 0666. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0672 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
Reel/Frame 017675/0199 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2005
From: VANCOILLE, ERIC; VAN HAASTEREN, ADRIANUS J.P.; FLENS, FRANK
To: AGILENT TECHNOLOGIES INC.
Reel/Frame 015599/0389 →