Optimization of routing layers and board space requirements for a ball grid array land pattern
View Patent ↗A method, system, and apparatus for optimizing routing layers and board space requirements for a ball grid array land pattern is described. The land pattern includes a plurality of conductive pads arranged in an array of rows and columns. The array of pads has at least one edge of a perimeter of the array not fully populated with conductive pads, whereby spaces are created in the at least one edge by the missing conductive pads. The spaces create additional routing channels for signals from conductive pads within the array to be routed externally to the array through the at least one edge.
1. A ball grid array land pattern comprising:
a plurality of conductive pads arranged in an array of rows and columns, wherein at least one edge of a perimeter of said array is not fully populated with conductive pads, whereby spaces created in said at least one edge by missing conductive pads create additional routing channels for signals from conductive pads within said array to be routed external to said array through said at least one edge,
wherein a ratio of conductive pads in said at least one edge to a number of said spaces in said at least one edge is at least two to one (2:1).
2. The land pattern of claim 1 , wherein said at least one edge includes a plurality of serially aligned conductive pads having a space therebetween, wherein said space allows for at least one additional routing channel than when said at least one edge is fully populated.
3. The land pattern of claim 2 , wherein said space allows for two additional routing channels than when said at least one edge is fully populated.
4. The land pattern of claim 1 , wherein said at least one edge includes a plurality of serially aligned conductive pads having spaces therebetween created by missing pads, wherein said spaces create additional routing channels for signals from said conductive pads within said array to be routed external to said array through said at least one edge.
5. The land pattern of claim 4 , wherein a higher proportion of said plurality of conductive pads are accessible by routing channels on a common layer with said conductive pads than when said at least one edge of said array is fully populated with pads.
6. The land pattern of claim 4 , wherein said array has a higher ratio of conductive pads that are externally routable on a single layer of said substrate material to conductive pads that are not externally routable on the single layer than when said at least one edge of said array is fully populated with pads.
7. The land pattern of claim 1 , wherein said at least one edge comprises a first conductive pad and a second conductive pad separated by a space due to a missing conductive pad, the land pattern further comprising seven conductive routing channels routed between the first conductive pad and the second conductive pad from said conductive pads within said array external to said array.
8. The land pattern of claim 1 , wherein a row or column of said array parallel and adjacent to said at least one edge is substantially fully populated with conductive pads.
9. The land pattern of claim 8 , wherein said at least one edge includes a repeating pattern of a first conductive pad, a space, and a second conductive pad, positioned in series.
10. A ball grid array land pattern comprising:
a plurality of conductive pads arranged in an array of rows and columns, wherein at least one edge of a perimeter of said array is not fully populated with conductive pads, whereby spaces created in said at least one edge by missing conductive pads create additional routing channels for signals from conductive pads within said array to be routed external to said array through said at least one edge;
wherein a number of said spaces is equal to S, where
S =INT(( E− 5)/3),
where:
E=a number of conductive pads in said at least one edge, if fully populated; and
INT is an INTEGER function, rounded down.
11. A land pattern comprising:
a plurality of conductive pads arranged in an array of rows and columns, wherein an edge of a perimeter of said array is not fully populated with conductive pads, whereby spaces created in said edge by missing conductive pads create additional routing channels for signals from conductive pads within said array to be routed external to said array through said edge;
wherein a ratio of conductive pads in said edge to a number of said spaces in said edge is at least two to one (2:1).
12. The land pattern of claim 11 , wherein said edge includes a plurality of serially aligned conductive pads having a space therebetween, wherein said space allows for at least one additional routing channel than when said edge is fully populated.
13. The land pattern of claim 12 , wherein said space allows for two additional routing channels than when said edge is fully populated.
14. The land pattern of claim 11 , wherein said edge includes a plurality of serially aligned conductive pads having spaces therebetween created by missing pads, wherein said spaces create additional routing channels for signals from said conductive pads within said array to be routed external to said array through said edge.
15. The land pattern of claim 14 , wherein a higher proportion of said plurality of conductive pads are accessible by routing channels on a common layer with said conductive pads than when said edge of said array is fully populated with pads.
16. The land pattern of claim 14 , wherein said array has a higher ratio of conductive pads that are externally routable on a single layer of said substrate material to conductive pads that are not externally routable on the single layer than when said edge of said array is fully populated with pads.
17. The land pattern of claim 11 , wherein said edge comprises a first conductive pad and a second conductive pad separated by a space due to a missing conductive pad, the land pattern further comprising seven conductive routing channels routed between the first conductive pad and the second conductive pad from said conductive pads within said array external to said array.
18. The land pattern of claim 11 , wherein a row or column of said array parallel and adjacent to said edge is substantially fully populated with conductive pads.
19. The land pattern of claim 18 , wherein said edge includes a repeating pattern of a first conductive pad, a space, and a second conductive pad, positioned in series.
20. A land pattern, comprising:
a plurality of conductive pads arranged in an array of rows and columns, wherein an edge of a perimeter of said array is not fully populated with conductive pads, whereby spaces created in said edge by missing conductive pads create additional routing channels for signals from conductive pads within said array to be routed external to said array through said edge,
wherein a number of said spaces is equal to S, where
S =INT(( E− 5)/3),
where:
E=a number of conductive pads in said edge, if fully populated; and
INT is an INTEGER function, rounded down.