Memory package
View Patent ↗A memory chip package with a controller die on a first side of a printed circuit board and a memory die on a second side of the same printed circuit board. The memory chip package is integrated into a microprocessor controlled device or alternatively is integrated into a portable memory card.
1. A method of making a memory package comprising:
attaching a plurality of memory die to the first face of a circuit board;
creating a plurality of recesses within a second face of the circuit board, each recess beneath the location of a memory die;
attaching a plurality of controller die to the second face of the circuit board, each controller die positioned beneath a memory die and within a recess of the second face;
forming vias in the circuit board connecting each memory die to a controller die beneath the memory die, to form a plurality of memory packages; and
singulating the plurality of memory packages to form individual memory packages.
2. The method of claim 1 further comprising fabricating the circuit board from one or more conductive layers and one or more insulating layers.
3. The method of claim 2 further comprising fabricating the circuit board from two or more circuit boards.
4. The method of claim 2 further comprising forming bond wires coupled to the vias.
5. The method of claim 4 further comprising coupling the bond wires to each of the plurality of controller die.
6. The method of claim 4 further comprising coupling the bond wires to each of the plurality of memory die.
7. The method of claim 1 wherein each individual memory package comprises one or more memory die.