Granted Patent B2

US 7,347,750 · App. 10/922,789 · Granted Mar 25, 2008

Abstract

Claims (16)

1. A surface mount contact for coupling to an electronic device comprising: a conductive pin having an elongated body including a first end and a second end; a heat re-flowable bonding member coupled to the first end; and a conductive substrate disposed around the conductive pin between the first and second ends and adjacent the heat re-flowable bonding member, wherein the substrate is a collar that radially protrudes from the pin and has an opening through which the pin extends and a surface thereof that is adjacent the heat re-flowable bonding member is conductive, wherein the second end of the pin has a head formed thereat for placement against a conductive surface and wherein the dimensions of the head are either substantially equal to dimensions of the conductive substrate or the dimensions of the head are greater than the dimensions of the conductive substrate.

2. A circuit board assembly comprising: a first circuit board having at least one first contact; a second circuit board having at least one second contact; and at least one surface mount contact of claim 1 , wherein the second end of the pin is conductively coupled to the at least one first contact and the first end of the pin is conductively coupled to the at least one second contact by reflowing the heat re-flowable bonding member.

3. The assembly of claim 2 , wherein the first circuit board comprises a printed circuit board with the first contact in the form of a through hole contact.

4. The assembly of claim 3 , further including a second heat re-flowable bonding member disposed within the through hole contact to electrically connect the second pin end to the first contact.

5. The assembly of claim 2 , wherein the second circuit board comprises a printed circuit board with the second contact in the form of a contact pad to which the heat re-flowable bonding member is attached after re-flowing thereof.

6. The assembly of claim 2 , wherein one face of the locator member lies flush against an opposing face of the first printed circuit board.

7. The assembly of claim 2 , wherein the locator member is formed of a metal that has a non-wettable surface that faces the heat re-flowable bonding member and on which the heat re-flowable bonding member is disposed.

8. A surface mount contact for coupling to an electronic device comprising: a conductive pin having an elongated body including a first end and a second end; a heat re-flowable bonding member coupled to the first end; and a conductive locator member disposed around the conductive pin between the first and second ends and adjacent the heat re-flowable bonding member, wherein the locator member is a collar that radially protrudes from the pin and has an opening through which the pin extends and a surface thereof that is adjacent the heat re-flowable bonding member is conductive, wherein the locator member has a first face and a second face with the first face having a recessed section.

9. The contact of claim 8 , wherein the locator has an opening formed therethrough with the recessed section being formed about the opening.

10. The contact of claim 9 , wherein the opening is centrally located in the recessed section.

11. The contact of claim 9 , wherein the first face has a planar surface that surrounds an outer edge of the recessed section.

12. A surface mount contact for coupling to an electronic device comprising: a conductive pin having an elongated body including a first end and a second end; a heat re-flowable bonding member coupled to and being separate from the first end such that the heat re-flowable bonding member extends about at least a surface of the first end; and a conductive locator member disposed around the conductive pin between the first and second ends and immediately adjacent the heat re-flowable bonding member, the conductive locator member being movable along a longitudinal length of the conductor pin, wherein at least a first surface of the conductive locator member comprises a conductive profiled surface that is a non-wettable surface positioned such that it faces and is in intimate contact with the heat re-flowable bonding member.

13. The contact of claim 12 , wherein the profiled surface comprises a concave shape recess formed in the first surface with a planar edge being formed around a peripheral edge of the recess.

14. A method of forming a solder ball on a surface mount contact for coupling to an electronic device, the method comprising: providing the surface mount contact; the surface mount contact including a conductive pin having an elongated body including a first end and a second end and a conductive locator member that has a through opening for receiving the pin; forming a concave shaped recess in a first surface of the conductive locator member, with the opening extending through the concave shaped recess, wherein at least the first surface is a non-wettable surface; inserting the pin through the opening so that at least the first end thereof extends beyond the first surface of the conductive locator member; placing a mass of heat re-flowable bonding member within the concave-shaped recess about the first end of the pin; and reflowing the heat re-flowable bonding member so that the heat re-flowable bonding member flows into a spherically-shaped body that forms about and attaches to the first end of the pin.

15. The method of claim 14 , wherein the step of placing a mass of heat re-flowable bonding member comprises placing an unshaped mass of solder material with the concave shaped recess surrounding the first end of the pin.

16. The method of claim 14 , wherein the step of forming a concave shaped recess in a first surface of the conductive locator member comprises the step of forming the concave shaped recess in a central portion of the first surface such that a planar outer edge is defined surrounding the peripheral edge of the recess.

Assignments (8)