IP Library › Assignment 023075/0306
Patent Assignment
Reel/Frame 023075/0306

Assignment of Assignor's Interest

Recorded: 2009-08-11 Received: 2009-08-11 Pages: 8
Assignor
NAS HOLDING CORP.
Executed: 2009-08-07
Assignee
INTERPLEX INDUSTRIES, INC.
14-34 110 STREET, SUITE 301, COLLEGE POINT, NY, 11356, UNITED STATES
Covered Properties (16)
Press Fit (Compliant) Terminal and Other Connectors with Tin-Silver Compound
Solder Wire Construction
Planar Spring Assembly with Attached Solder Strip and Method for Making Same
Method and Apparatus for Die Casting of Parts
Solder-Bearing Contacts and Method of Manufacture Thereof and Use in Connectors
Application: 11/981,927 →
High Density Interconnection Device With Dielectric Coating
Application: 11/908,657 →
Sliding Mechanism with Spring Positioning
Application: 11/750,765 →
Method for Forming an Etched Soft Edge Metal Foil and the Product Thereof
Application: 11/457,369 →
Method of Retaining a Solder Mass on an Article
Application: 10/509,200 →
Method for reflowing a metal plating layer of a contact and contact formed thereby
Application: 11/234,857 →
Solder-Bearing Contacts and Method of Manufacture Thereof and Use in Connectors
Application: 10/922,789 →
Openable One-Piece Electrical Rf Shield and Method of Manufacturing the Same
Application: 10/449,807 →
Solder-Bearing Electromagnetic Shield
Application: 10/341,191 →
Solder-Bearing Components and Method of Retaining a Solder Mass Therein
Application: 10/341,190 →
Two-Piece Electrical Rf Shield and Method of Manufacturing the Same
Application: 10/286,373 →
Solder-Holding Clips for Applying Solder to Connectors or the Like
Application: 10/038,418 →