Solder-bearing contacts and method of manufacture thereof and use in connectors
View Patent ↗In one aspect, a surface mount contact is provided for attachment to a circuit board or the like. The contact includes an elongated electrically conductive pin that has a first end and an opposing second end. A pre-formed heat re-flowable material is attached to one end of the pin and a conductive locator member surrounds the pin at a location between the first and second ends thereof and adjacent the conductive locator member. In one embodiment, the locator member is in the form of a cylindrical collar that extends around the pin.
1. A surface mount contact for coupling to an electronic device comprising:
a conductive pin having an elongated body including a first end and a second end;
a heat re-flowable bonding member coupled to the first end; and
a conductive locator member disposed around the conductive pin in a region of the conductive pin between the second end and the heat re-flowable bonding member, wherein the locator member is a collar that radially protrudes from the conductive pin, the locator member having a conductive surface and an opening through which the conductive pin extends such that an annular volume of space extending radially outward from the conductive pin and substantially free of material is defined between the conductive surface of the locator member and the bonding member.
2. The contact of claim 1 , wherein the locator member is formed of aluminum.
3. The contact of claim 1 , wherein the pin has a cross-sectional shape selected from the group consisting of a circle, square, triangle, and rectangle.
4. The contact of claim 1 , wherein the locator member is press-fitted around the pin.
5. The contact of claim 1 , wherein the pin is formed of a metal selected from the group consisting of copper, copper alloy, and stainless steel.
6. The contact of claim 1 , wherein the heat re-flowable bonding member is in the form of a solder ball, with the first end of the pin being embedded therein.
7. The contact of claim 1 , wherein the heat re-flowable bonding member is a pre-formed solder mass.