Folded fin heat sink assembly
A folded fin heat sink assembly and a method of fabricating a folded fin heat sink assembly for use as a cooling solution in micro-electronics and/or telecommunication applications. The heat sink assembly is formed by placing a sheet or paste of Sn—Zn solder upon a copper base plate, placing one or more aluminum folded fin assemblies on the solder sheet or paste, heating the base plate, the folded fin assembly and the solder to a temperature exceeding the liquidus temperature of the solder and allowing the solder to flow, and cooling the solder to form a soldered joint between the base plate and the folded fin assembly.
1 . A folded fin heat sink assembly, comprising:
a base plate; and
a folded fin structure soldered to said base plate with a lead-free solder comprising Sn and Zn.
2 . The folded fin heat sink assembly of claim 1 wherein said folded fin structure comprises Al.
3 . The folded fin heat sink assembly of claim 1 wherein said base plate comprises Cu.
4 . The folded fin heat sink assembly of claim 1 wherein said folded fin structure comprises Cu.
5 . The folded fin heat sink assembly of claim 1 wherein said base plate comprises Al.
6 . The folded fin heat sink assembly of claim 1 wherein said lead-free solder comprises about 91% Sn and about 9% Zn.
7 . The folded fin heat sink assembly of claim 1 wherein said base plate is unplated.
8 . The folded fin heat sink assembly of claim 1 wherein said base plate is nickel plated.
9 . A method of constructing a folded fin heat sink assembly, comprising:
placing a lead-free solder comprising Sn and Zn on a base plate;
placing a folded fin structure on the lead-free solder on the base plate;
heating said lead-free solder to a temperature exceeding the liquidus temperature of the solder; and
cooling said lead-free solder to form a soldered joint between said base plate and said folded fin structure.
10 . The method of claim 9 wherein said folded fin structure comprises Al.
11 . The method of claim 9 wherein said base plate comprises Cu.
12 . The method of claim 9 wherein said folded fin structure comprises Cu.
13 . The method of claim 9 wherein said base plate comprises Al.
14 . The method of claim 9 wherein said lead-free solder comprises about 91% Sn and about 9% Zn.
15 . The method of claim 9 wherein said base plate is unplated.
16 . The method of claim 9 wherein said base plate is nickel plated.
17 . The method of claim 9 wherein heating said lead-free solder comprises heating said lead-free solder to a temperature of about 220 to 260 degrees Celsius.
18 . A heat sink assembly, comprising:
a nickel plated base plate; and
a fin structure soldered to said base plate with a lead-free solder comprising Sn and Zn.
19 . The heat sink assembly of claim 18 wherein said fin structure comprises Al.
20 . The heat sink assembly of claim 18 wherein said base plate comprises Cu.
21 . The heat sink assembly of claim 18 wherein said fin structure comprises Cu.
22 . The heat sink assembly of claim 18 wherein said base plate comprises Al.
23 . The heat sink assembly of claim 18 wherein said lead-free solder comprises about 91% Sn and about 9% Zn.
24 . A method of constructing a heat sink assembly, comprising:
placing a lead-free solder comprising Sn and Zn on a nickel plated base plate;
placing a fin structure on the lead-free solder on the base plate;
heating said lead-free solder to a temperature exceeding the liquidus temperature of the solder; and
cooling said lead-free solder to form a soldered joint between said base plate and said fin structure.
25 . The method of claim 24 wherein said fin structure comprises Al.
26 . The method of claim 24 wherein said base plate comprises Cu.
27 . The method of claim 24 wherein said fin structure comprises Cu.
28 . The method of claim 24 wherein said base plate comprises Al.
29 . The method of claim 24 wherein said lead-free solder comprises about 91% Sn and about 9% Zn.
30 . The method of claim 24 wherein heating said lead-free solder comprises heating said lead-free solder to a temperature of about 220 to 260 degrees Celsius.