Lithographic methods to reduce stacking fault nucleation sites
Epitaxial silicon carbide layers are fabricated by forming features in a surface of a silicon carbide substrate having an off-axis orientation toward a crystallographic direction. The features include at least one sidewall that is orientated nonparallel (i.e., oblique or perpendicular) to the crystallographic direction. The epitaxial silicon carbide layer is then grown on the surface of the silicon carbide substrate that includes features therein.
1. A method of fabricating an epitaxial silicon carbide layer comprising:
forming a plurality of features in a surface of a silicon carbide substrate having an off-axis orientation toward a predetermined crystallographic direction, the plurality of features including at least one sidewall that is oriented nonparallel to the predetermined crystallographic direction; and
growing the epitaxial silicon carbide layer on the surface of the silicon carbide substrate that includes the plurality of features therein, the epitaxial silicon carbide layer being thicker than a depth of the at least one sidewall.
2. A method according to claim 1 wherein forming a plurality of features comprises:
masking the surface of the silicon carbide substrate having an off-axis orientation toward a predetermined crystallographic direction; and
etching the surface of the silicon carbide substrate that is exposed by the masking to form the plurality of features in the surface of a silicon carbide substrate that is masked.
3. A method according to claim 2 wherein etching comprises dry etching the surface of the silicon carbide substrate that is masked using NF 3 and/or SF 6 .
4. A method according to claim 1 wherein the predetermined crystallographic direction is a <11 2 0> direction.
5. A method according to claim 1 wherein forming a plurality of features comprises forming a plurality of trenches in the surface of the silicon carbide substrate having an off-axis orientation toward a predetermined crystallographic direction, the plurality of trenches extending oblique and/or perpendicular to the predetermined crystallographic direction and including at least one sidewall that is oriented nonparallel to the predetermined crystallographic direction.
6. A method according to claim 1 wherein forming a plurality of features comprises forming a plurality of depressions in the surface of the silicon carbide substrate having an off-axis orientation toward a predetermined crystallographic direction and including at least one sidewall that is oriented nonparallel to the predetermined crystallographic direction.
7. A method according to claim 6 wherein the plurality of depressions comprises a periodically repeating pattern of hexagonal pits.
8. A method according to claim 1 wherein growing the epitaxial silicon carbide layer comprises:
growing the epitaxial silicon carbide layer on the surface of the silicon carbide substrate that includes the plurality of features therein such that the epitaxial silicon carbide layer contains lower basal plane dislocation density than the silicon carbide substrate.
9. A method according to claim 1 further comprising:
forming a semiconductor device in the epitaxial silicon carbide layer.
10. A method of fabricating an epitaxial monocrystalline layer comprising:
forming a plurality of features in a surface of a monocrystalline substrate having an off-axis orientation toward a predetermined crystallographic direction, the plurality of features including at least one sidewall; and
growing the epitaxial layer on the surface of the monocrystalline substrate that includes the plurality of features therein, the epitaxial layer being thicker than a depth of the at least one sidewall.
11. A method according to claim 10 wherein forming a plurality of features comprises:
masking the surface of the monocrystalline substrate having an off-axis orientation toward a predetermined crystallographic direction; and
etching the surface of the monocrystalline substrate that is masked to form the plurality of features in the surface of a monocrystalline substrate that is masked.
12. A method according to claim 10 wherein growing the epitaxial layer comprises:
growing the epitaxial layer on the surface of the monocrystalline substrate that includes the plurality of features therein such that the epitaxial layer contains lower basal plane dislocation density than the monocrystalline substrate.
13. A method according to claim 10 wherein the monocrystalline substrate comprises silicon carbide.
14. A method of fabricating an epitaxial silicon carbide layer comprising:
epitaxially growing from at least one sidewall of a periodically repeating pattern of hexagonal pits in a surface of a silicon carbide substrate having an off-axis orientation toward a predetermined crystallographic direction to form the epitaxial silicon carbide layer, the at least one sidewall of the periodically repeating pattern of hexagonal pits being oriented nonparallel to the predetermined crystallographic direction.
15. A method according to claim 14 wherein the predetermined crystallographic direction is a <11 2 0 > direction.
16. A method according to claim 14 wherein the epitaxial silicon carbide layer contains lower basal plane dislocation density than the silicon carbide substrate.