Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers
View Patent ↗An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature. The device alignment feature and the optical communications device have a defined positional relationship with respect to one another. Alternatively, the system may additionally comprise a cover assembly including a cover comprising a device alignment feature. The cover is mechanically coupled to the first support element in a position at which the device alignment feature and the optical communications device have a predetermined positional relationship with respect to one another.
1. An integrated packaging system for packaging an optical communications device, the packaging system comprising:
a metal mechanical support including a first support element and a second support element, the first support element extending at a non-zero angle from the second support element;
an insulating substrate including a first portion and a second portion in contact with the first support element and the second support element, respectively;
a conductive track supported by at least the first portion of the insulating substrate;
the optical communications device mechanically coupled to the first support element of the mechanical support; and
an electronic circuit mechanically coupled to the first support element of the mechanical support adjacent the optical communications device and electrically connected to the optical communications device.
2. The integrated packaging system of claim 1 , in which at least one of the optical communications device and the electronic circuit is thermally coupled to the first support element to enable the mechanical support to function as a heatsink for the at least one of the optical communications device and the electronic circuit.
3. The integrated packaging system of claim 1 , in which the insulating substrate is flexible.
4. The integrated packaging system of claim 1 , in which at least one of the optical communications device and the electronic circuit is electrically insulated from the mechanical support.
5. An integrated packaging system for packaging an optical communications device, the packaging system comprising:
a rigid mechanical support including a first outward-facing surface and a second outward-facing surface disposed orthogonally to the first outward-facing surface;
the optical communications device mechanically coupled to the first outward-facing surface of the mechanical support;
a cover assembly to protect the optical communications device, the cover assembly having an aligning member extending from the cover assembly; and
an alignment recess defined by the first support element, the alignment recess configured to engage the aligning member of the cover assembly.
6. The integrated packaging system of claim 5 , in which:
the mechanical support is thermally conductive; and
the optical communications device is thermally coupled to the first outward-facing surface to enable the mechanical support to function as a heatsink therefor.
7. The integrated packaging system of claim 5 , additionally comprising:
an insulating substrate including a first portion and a second portion in contact with the first outward-facing surface and the second outward-facing surface, respectively; and
a conductive track supported by at least the first portion of the insulating substrate.
8. The integrated packaging system of claim 7 , wherein:
the packaging system additionally comprises an electrical connector adjacent the second outward-facing surface of the mechanical support; and
the conductive track extends to the electrical connector additionally supported by the second portion of the insulating substrate.
9. The integrated packaging system of claim 8 , wherein the electrical connector comprises an array of solder balls.
10. The integrated packaging system of claim 5 , additionally comprising a flexible printed circuit board wrapped to conform to the outer surfaces of the mechanical support and comprising a trace electrically connected to the optical communications device.
11. The integrated packaging system of claim 10 , in which:
the packaging system additionally comprises an electrical connector adjacent the second outward-facing surface of the mechanical support; and
the electrical connector is electrically connected to the flexible printed circuit board.
12. The integrated packaging system of claim 5 , in which the optical communications device is electrically insulated from the mechanical support.
13. The integrated packaging system of claim 1 , in which the electronic circuit is electrically coupled to the first support element of the mechanical support and the first support element operates as a low-impedance current path.
14. The integrated packaging system of claim 1 , additionally comprising:
a cover assembly to protect the optical communications device, the cover assembly having an aligning member extending from the cover assembly; and
an alignment recess defined by the first support element, the alignment recess configured to engage the aligning member of the cover assembly.
15. The integrated packaging system of claim 14 , wherein the alignment recess extends partially into the first support element from a first major surface of the first support element.
16. The integrated packaging system of claim 14 , wherein the alignment recess extends through the first support element from a first major surface to a second major surface of the first support element.
17. An integrated packaging system for packaging an optical communications device, the packaging system incorporating a metal mechanical support, the metal mechanical support comprising:
a first support element having an alignment hole for providing automatic alignment between the optical communications device and an optical fiber mounted in a fiber optic connector when the fiber optic connector is coupled to the packaging system of the optical communications device; and
a second support element extending at a non-zero angle from the first support element, the second support element configured to operate as one of a heatsink and a low-impedance current path to an electronic circuit mounted on the second support element.
18. The integrated packaging system of claim 17 , wherein the second support element is configured to operate as the low-impedance current path from a voltage source to the electronic circuit mounted on the second support element.