Multilayer integrated circuit for RF communication and method for assembly thereof
View Patent ↗A low profile radio frequency (RF) module and package with efficient heat dissipation characteristics, and a method of assembly thereof, are provided. In some embodiments, the RF module package comprises a radio frequency integrated circuit (RFIC) attached to a recessed area of a lead frame. The RFIC has an active integrated circuit pattern and a plurality of conductors formed on input/output pads of the active integrated circuit pattern. An integrated passive device (IPD) is attached to the RFIC via the plurality of conductors. The IPD has a passive integrated circuit pattern, a plurality of electrode pads connected to nodes of the passive integrated circuit pattern, and metal-filled vias for electrically connecting the electrode pads to the plurality of conductors. The RFIC includes a plurality of heat conducting vias for conducting heat to the lead frame.
1. A vertically integrated radio frequency module, comprising:
a radio frequency integrated circuit die including, on an upper surface thereof, active integrated circuits having an input/output pad, the radio frequency integrated circuit die further comprising a heat conducting via that thermally couples the active integrated circuits to a lead frame;
a conductor disposed within a first filling space adjacent to the upper surface of the radio frequency integrated circuit die, the conductor coupled to the input/output pad; and
an integrated passive device die disposed above the radio frequency integrated circuit die and the first filling space, the integrated passive device die including, on an upper surface thereof, a passive integrated circuit pattern having an electrode pad electrically connected to the conductor, wherein the passive integrated circuit pattern is coupled to the active integrated circuits, and the lead frame by a via through the integrated passive device die, the conductor and the heat conducting via.
2. The radio frequency module of claim 1 wherein the conductor is a stud bump.
3. The radio frequency module of claim 1 wherein the conductor is a solder bump.
4. The radio frequency module of claim 1 wherein the conductor is an electroless bump.
5. The radio frequency module of claim 1 wherein the integrated passive device and the radio frequency integrated circuit dies have a same lateral dimension.
6. The radio frequency module of claim 1 wherein the heatconducting via comprises a metallization layer.
7. The radio frequency module of claim 6 wherein the heat conducting via includes a metal plug on the upper surface of the radio frequency integrated die.
8. The radio frequency module of claim 7 wherein the heat conducting via includes an air space.
9. The radio frequency module of claim 1 wherein the radio frequency integrated circuit die includes gallium arsenide and the integrated passive device die includes silicon.
10. A vertically integrated radio frequency module package, comprising:
a lead frame;
a radio frequency integrated circuit die attached to the lead frame and including, on an upper surface thereof, active integrated circuits having an input/output pad, the radio frequency integrated circuit die further comprising a heat conducting via that thermally couples the active integrated circuits to the lead frame;
a conductor disposed within a first filling space adjacent to the upper surface of the radio frequency integrated circuit die, the conductor coupled to the input/output pad; and
an integrated passive device die disposed above the radio frequency integrated circuit die and the first filling space, the integrated passive device die including, on an upper surface thereof, a passive integrated circuit pattern having an electrode pad electrically connected to the conductor, wherein the passive integrated circuit pattern is coupled to the active integrated circuits, and the lead frame by a via through the integrated passive device die, the conductor and the heat conducting via.
11. The radio frequency module package of claim 10 wherein the lead frame includes a recessed area.
12. The radio frequency module package of claim 11 wherein the radio frequency integrated circuit die is attached to the lead frame within the recessed area.
13. The radio frequency module package of claim 10 wherein the radio frequency integrated circuit die is attached to the lead frame with a solder paste.
14. The radio frequency module package of claim 10 wherein the space is filled with an electrically insulating material.
15. The radio frequency module package of claim 10 further comprising a protective material covering the lead frame and the radio frequency integrated circuit and integrated passive device dies.
16. The radio frequency module package of claim 15 wherein the protective material includes a thermosetting material.
17. The radio frequency module package of claim 10 wherein the lead frame includes coupling fingers.
18. The radio frequency module package of claim 17 wherein the coupling fingers are used as external pins.