IP Library Granted Patent US 7,057,833
Granted Patent B2
US 7,057,833 · App. 10/934,709 · Granted Jun 6, 2006

Image capture device

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Quick Facts
Patent No.
US 7,057,833
App. No.
10/934,709
Granted
Jun 6, 2006
Kind
B2
Abstract

An image capture device includes a substrate and an image sensor mounted to a front side of the substrate. A lens module having a light blocking member is mounted to the front side of the substrate so that the light blocking member cooperates with the substrate to substantially prevent light from entering an interior region defined by the lens module and the substrate through a joint defined therebetween. A lens indexing member on the lens module cooperates with a substrate indexing member provided on the substrate to align the lens module with respect to the substrate.

Claims (32)

1. An image capture device, comprising:

a substrate having a front side and a back side;

a substrate indexing member provided on said substrate;

an image sensor mounted to the front side of said substrate;

a lens module mounted to the front side of said substrate;

a light blocking member provided on said lens module, said light blocking member cooperating with said substrate to substantially prevent light from entering an interior region defined by said lens module and said substrate through a joint defined between said lens module and said substrate; and

a lens indexing member provided on said lens module, said lens indexing member cooperating with said substrate indexing member to align said lens module with respect to said substrate.

2. The image capture device of claim 1 , further comprising a perimeter ring mounted to the front side of said substrate.

3. The image capture device of claim 2 , wherein said substrate indexing member comprises a notch defined by said perimeter ring.

4. The image capture device of claim 3 , wherein said lens indexing member comprises a pin, said pin being sized to be received by the notch defined by said perimeter ring.

5. The image capture device of claim 4 , wherein said pin is defined by said lens module.

6. The image capture device of claim 2 , wherein said light blocking member comprises a shoulder, said shoulder fitting in adjacent relationship to said perimeter ring, the adjacent relationship of the shoulder defined by said lens module and the perimeter ring mounted to the front side of said substrate blocking light from entering the interior region through the joint defined between said lens module and said substrate.

7. The image capture device of claim 6 , wherein said shoulder is defined by said lens module.

8. The image capture device of claim 1 , wherein said substrate comprises a ceramic material.

9. The image capture device of claim 1 , wherein said lens module comprises a polymer material.

10. The image capture device of claim 1 , wherein the back side of said substrate includes a plurality of solder pads therein and wherein said image sensor is electrically connected to the plurality of solder pads provided on the back side of said substrate.

11. An image capture device, comprising:

a substrate having a front side, a back side, and a substrate indexing member;

an image sensor mounted to the front side of said substrate; and

a lens module mounted to the front side of said substrate, said lens module including a light blocking member, the light blocking member substantially preventing light from entering an interior region defined by said lens module and said substrate through a joint defined between said lens module and said substrate, said lens module also including a lens indexing member, said lens indexing member cooperating with the substrate indexing member to align said lens module and said substrate.

12. The image capture device of claim 11 , wherein said substrate defines a raised perimeter on the front side of said substrate.

13. The image capture device of claim 12 , wherein the light blocking member comprises a shoulder, said shoulder fitting in adjacent relationship to the raised perimeter on the front side of said substrate, the adjacent relationship of the shoulder and the raised perimeter substantially preventing light from entering the interior region through the joint defined between said lens module and said substrate.

14. The image capture device of claim 13 , wherein said shoulder is defined by said lens module.

15. The image capture device of claim 12 , wherein the substrate indexing member comprises a notch defined by the raised perimeter of said substrate.

16. The image capture device of claim 15 , wherein the lens indexing member comprises a pin sized to be received by the notch defined by the raised perimeter of said substrate.

17. The image capture device of claim 16 , wherein said pin is defined by said lens module.

18. The image capture device of claim 11 , wherein said substrate comprises ceramic.

19. The image capture device of claim 11 , further comprising a plurality of solder pads provided on the back side of said substrate and wherein said image sensor is electrically connected to the plurality of solder pads provided on the back side of said substrate.

20. An image capture device, comprising:

a substrate having a front side, and a raised perimeter, said raised perimeter defining a notch therein;

an image sensor mounted to the front side of said substrate;

a lens module mounted to the front side of said substrate, said lens module including a shoulder, said shoulder fitting in adjacent relationship to the raised perimeter on said substrate, the adjacent relationship of the shoulder and the raised perimeter substantially preventing light from entering an interior region defined by said lens module and said substrate through a joint defined between said lens module and said substrate, said lens module also including a pin, said pin engaging the notch defined by the raised perimeter of said substrate to align said lens module and said substrate.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 017206 FRAME: 0666. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →