Voltage non-uniformity compensation method for high frequency plasma reactor for the treatment of rectangular large area substrates
View Patent ↗A vacuum vessel and at least two electrodes define an internal process space. At least one power supply is connectable with the electrodes. A substrate holder holds a substrate to be treated in the internal process space. At least one of the electrodes has along a first cross section a concave profile and has along a second cross section a convex profile, the first cross section being parallel to the second cross section. Gas is provided to the space through a gas inlet. Power is provided to the electrodes and the substrate is treated.
1. Vacuum treatment apparatus comprising a vacuum vessel, at least two electrodes defining an internal process space, at least one power supply connectable with said electrodes, a substrate holder for a substrate to be treated in the internal process space and gas inlet means, wherein at least one of said electrodes has a surface with peripheral edges that define a rectangular or square shape when viewed from above, said surface having a generally convex profile along a respective edge cross section taken along each said peripheral edge, which profile gradually changes on approaching the center of said electrode to become a concave profile along a center cross section that is parallel to the respective edge cross section and is taken through the center of said surface.
2. A vacuum treatment apparatus according to claim 1 , wherein two of said electrodes each have first and second surfaces, respectively, each with peripheral edges that define a rectangular or square shape when the respective surface is viewed from above, each said surface having a generally convex profile along a respective edge cross section taken along each said peripheral edge of each said surface, which profile gradually changes on approaching the center of each said surface to become a concave profile along a center cross section that is parallel to the respective edge cross section of the respective surface and is taken through the center thereof.
3. A vacuum treatment apparatus according to claim 2 , wherein said electrodes are shaped equally.
4. A vacuum treatment apparatus according to claim 1 , wherein the power supply is a radiofrequency power supply for frequencies of 13.56 MHz or higher.
5. A vacuum treatment apparatus according to claim 1 , wherein at least one of said electrodes is connectable with the power supply at least two connection points.
6. A vacuum treatment apparatus according to claim 1 , wherein the space between said substrate and one of the electrodes is at least partially furnished with a corrective dielectric layer.
7. A vacuum treatment apparatus according to claim 6 , wherein one surface of the corrective dielectric layer complements the shape of said surface of said at least one electrode.
8. A vacuum treatment apparatus according to claim 6 , wherein one surface of the corrective dielectric layer is being adapted to hold the substrate.
9. A vacuum treatment apparatus according to claim 6 , wherein the corrective dielectric layer comprises vacuum, gas, alumina, zirconia or quartz.
10. A vacuum treatment apparatus according to claim 1 , wherein the gas inlet system comprises a set of holes in an electrode and/or the corrective dielectric layer to provide gases to the internal process space.
11. A vacuum treatment apparatus according to claim 6 , wherein the gas inlet system comprises a set of holes in an electrode and/or the corrective dielectric layer to provide gases to the internal process space.