IP Library Granted Patent US 6,948,864
Granted Patent B2
US 6,948,864 · App. 10/936,367 · Granted Sep 27, 2005

Optoelectronic component with thermoelectric temperature control

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Quick Facts
Patent No.
US 6,948,864
App. No.
10/936,367
Granted
Sep 27, 2005
Kind
B2
Abstract

An optoelectronic device, for example a laser diode transmitter or receiver module is disclosed having thermoelectric control of the operating temperature of the device.

Claims (16)

1. An optoelectronic component, comprising a housing, an optoelectronic device, a thermoelectric device, and a heat sink for dissipating heat from the component, the optoelectronic device and thermoelectric device being mounted within the housing and the thermoelectric device being thermally bound to the optoelectronic device, wherein the thermoelectric device is operable in both a heating and a cooling mode in order to stabilise the operating temperature of the optoelectronic device, and the component includes a variable thermal link, said link being disposed between the thermoelectric device and the heat sink and said link being operable to control a variable thermal coupling between the thermoelectric device and the heat sink, such that the thermal coupling is reduced when the thermoelectric device is used to stabilise the operating temperature of the optoelectronic device by heating the optoelectronic device and relatively increased when the thermoelectric device is used to stabilise the operating temperature of the optoelectronic device by cooling the optoelectronic device, wherein the variable thermal link includes at least one movable feature which moves between a first position in which the thermoelectric device is relatively thermally isolated from the heat sink to a second position in which the thermoelectric device is relatively thermally connected to the heat sink.

2. An optoelectronic component as claimed in claim 1 , comprising additionally a temperature sensor and a controller, wherein the temperature sensor is arranged to sense the temperature of the optoelectronic device, the controller is arranged to receive a signal from the temperature sensor and to control in response to said received signal the operation of the variable thermal link in order to control the operating temperature of the optoelectronic device.

3. An optoelectronic component as claimed in claim 1 , in which the variable thermal link comprises a movable leaf, which moves to provide the variable thermal coupling between the thermoelectric device and the heat sink.

4. An optoelectronic component as claimed in claim 1 , in which the variable thermal link is passively operable to control the variable thermal coupling between the thermoelectric device and the heat sink.

5. An optoelectronic component as claimed in claim 1 , in which the variable thermal link is actively operable to control the variable thermal coupling between the thermoelectric device and the heat sink.

6. An optoelectronic component as claimed in claim 5 , comprising additionally an actuator for moving the movable feature.

7. An optoelectronic component as claimed in claim 6 , in which the actuator comprises a piezoelectric element.

8. An optoelectronic component as claimed in claim 6 , in which the actuator comprises a bimetallic strip.

9. An optoelectronic component as claimed in claim 1 , in which the movable feature further comprises a portion, which is affixed to the housing, and a portion which is movable towards and away from the thermoelectric device.

10. An optoelectronic component as claimed in claim 1 , in which the heat sink is provided by at least a portion of the housing.

11. A method of operating an optoelectronic component at a stabilised operating temperature, said component comprising a housing, an optoelectronic device, a thermoelectric device, a heat sink, a variable thermal link, and a source of electrical power, the optoelectronic device and thermoelectric device being mounted within the housing, the thermoelectric device being thermally bound to the optoelectronic device and the variable thermal link being disposed between the thermoelectric device and the heat sink, wherein the variable thermal link further comprises at least one movable feature, the at least one movable feature moving between a first position in which the thermoelectric device is relatively thermally isolated from the heat sink to a second position, said second position being with the thermoelectric device in a relatively thermal connected position with the heat sink, the method comprising the steps of:

i) supplying electrical power to run the optoelectronic device;

ii) supplying electrical power to the thermoelectric device such that said device is operated in a heating mode to heat the optoelectronic device and stabilise the operating temperature of the optoelectronic device when the temperature of the optoelectronic device is below a desired level;

iii) supplying electrical power the thermoelectric device such that said device is operated in a cooling mode to cool the optoelectronic device and stabilise the operating temperature of the optoelectronic device when the temperature of the optoelectronic device is above a desired level;

iv) using the variable thermal link to control a variable thermal coupling between the thermoelectric device and the heat sink, such that the thermal coupling is relatively reduced when the thermoelectric device is used to heat the optoelectronic device and relatively increased when the thermoelectric device is used to cool the optoelectronic device; and

v) using the heat sink to dissipate heat from the thermoelectric device when the thermoelectric device is used to cool the optoelectronic device and when the variable thermal coupling is relatively increased.

Assignments (9)
MERGER Recorded Mar 3, 2023
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED; BROADCOM INTERNATIONAL PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 062952/0850 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047196 FRAME: 0097. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048555/0510 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0097 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 017207 FRAME 0020. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038633/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →