Healing algorithm
View Patent ↗An aspect of the present invention includes a method for reshaping sub-objects in at least one object in pattern design data to be presented to a mask writer or a direct writer for producing a pattern onto a workpiece, where said object comprises a plurality of slivers in a first direction, comprising the actions of: a) generating a list of slivers, repeating the actions of: b) comparing a dynamic object in an object list with the slivers in said list of slivers to look for adjacent slivers, c) removing adjacent slivers from said list of slivers to said object list, d) merging adjacent slivers with said dynamic object, e) terminating the repetition when no slivers in said list of slivers are adjacent to said dynamic object in said object list. Other aspects of the present invention are reflected in the detailed description, figures and claims.
1. A method for reshaping sub-objects in at least one object in pattern design data to be presented to a mask writer or a direct writer for producing a pattern onto a workpiece, where said object comprises a plurality of slivers in a first direction, comprising the actions of:
a) generating a list of slivers,
repeating the actions of:
b) comparing a dynamic object in an object list with the slivers in said list of slivers to look for adjacent slivers,
c) removing adjacent slivers from said list of slivers to said object list,
d) merging adjacent slivers with said dynamic object,
e) terminating the repetition when no slivers in said list of slivers are adjacent to said dynamic object in said object list.
2. The method according to claim 1 , further comprising the action of
refracturing said dynamic object at least in a direction perpendicular to said first direction.
3. The method according to claim 1 , wherein said dynamic object is compared both on its lower and upper long side with an upper and lower long side respectively of each sliver in said list of slivers.
4. The method according to claim 1 , wherein said dynamic object originally is a sliver.
5. The method according to claim 1 , wherein said sliver is defined by its aspect ratio, which is equal to or smaller than 1:3.
6. The method according to claim 2 , wherein said refracturing divides said dynamic object into rectangles or trapezoids.
7. The method according to claim 1 , wherein said workpiece is a semi conducting substrate.
8. The method according to claim 1 , wherein said workpiece is a mask or reticle substrate.
9. The method according to claim 1 , wherein said mask writer or maskless writer is based on a spatial light modulator (abbreviated “SLM”) for generating the pattern on said workpiece.
10. The method according to claim 1 , wherein said mask writer or maskless writer is a raster type mask writer or maskless writer.
11. The method according to claim 1 , wherein said list of slivers comprising a smaller amount of slivers than the full amount of slivers in said pattern design data.
12. The method according to claim 1 , wherein said reshaping of said sub-objects comprising the action of:
minimizing a circumference of at least one object in said pattern design data.
13. The method according to claim 1 , wherein said mask writer or maskless writer is of a vector shaped beam (abbreviated “VSB”) type.