IP Library Granted Patent US 7,245,502
Granted Patent B2
US 7,245,502 · App. 10/940,253 · Granted Jul 17, 2007

Small form factor USB bluetooth dongle

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Quick Facts
Patent No.
US 7,245,502
App. No.
10/940,253
Granted
Jul 17, 2007
Kind
B2
Abstract

A small form factor USB Bluetooth dongle includes a printed circuit board (PCB), a USB contact area, and a radio frequency (RF) transceiver die. The PCB includes a first primary surface and a second primary surface. The USB contact area is fabricated on the first primary surface. The RF transceiver die is mounted on the second primary surface, wherein the RF transceiver is in accordance with Bluetooth.

Claims (57)

1. A small form factor universal serial bus (USB) Bluetooth dongle comprises:

a printed circuit board (PCB) having a first primary surface and a second primary surface;

a USB contact area on the first primary surface wherein the USB contact area is radially aligned with the RF transceiver die; and

a radio frequency (RF) transceiver die on the second primary surface, wherein the RF transceiver is in accordance with Bluetooth.

2. The small form factor USB Bluetooth dongle of claim 1 further comprises:

a USB metal shield at least partially encircling the USB contact area and the RF transceiver die.

3. The small form factor USB Bluetooth dongle of claim 1 further comprises:

a plastic filler encasing the RE transceiver die within the USB metal shield.

4. The small form factor USB Bluetooth dongle of claim 1 further comprises;

an electronically erasable programmable read only memory (EEPROM) mounted on the first surface adjacent to the USB contact area.

5. The small form factor USB Bluetooth dongle of claim 1 further comprises at least one of:

an antenna fabricated on the second primary surface;

an external chip antenna; and

an external metal antenna.

6. The small form factor USB Bluetooth dongle of claim 5 further comprises:

a ground plane on a surface of the PCB that is substantially parallel to the second primary surface, wherein the ground plane is radially aligned with the antenna on the second primary surface.

7. The small form factor USB Bluetooth dongle of claim 1 further comprises:

a plurality of capacitors,

at least one inductor,

at least one resistor, and

at least one crystal, wherein the plurality of capacitors, the at least one inductor, the at least one resistor, and the at least one crystal are mounted on the first and second primary surfaces.

8. The small form factor USB Bluetooth dongle of claim 1 further comprises an over mold.

9. A small form factor universal serial bus (USB) Bluetooth dongle comprises:

a printed circuit board (PCB) having a first primary surface and a second primary surface, wherein the first primary surface includes a first surface area and a second surface area, the second primary surface includes a first surface area and a second surface area, wherein the first surface area of the first primary surface is radially aligned with the first surface area of the second primary surface and the second surface area of the first primary surface is radially aligned with the second surface area of the second primary surface area;

a USB contact area in the first surface area of the first primary surface; and

a radio frequency (RF) transceiver die in the second surface area of the second primary surface, wherein the RF transceiver is in accordance with Bluetooth.

10. The small form factor USB Bluetooth dongle of claim 9 further comprises:

a USB metal shield at least partially encircling the USB contact area.

11. The small form factor USB Bluetooth dongle of claim 10 further comprises:

a plastic filler within the USB metal shield.

12. The small form factor USB Bluetooth dongle of claim 9 further comprises; an electronically erasable programmable read only memory (EEPROM) mounted in the second surface area of the first primary surface.

13. The small form factor USB Bluetooth dongle of claim 9 further comprises at least one of:

an antenna fabricated on the second surface area of the first primary surface;

an external chip antenna; and

an external metal antenna.

14. The small form factor USB Bluetooth dongle of claim 13 further comprises:

a ground plane on a surface of the PCB that is substantially parallel to the second primary surface, wherein the ground plane is radially aligned with the antenna on the second surface area of the first primary surface.

15. The small form factor USB Bluetooth dongle of claim 9 further comprises:

a plurality of capacitors,

at least one inductor,

at least one resistor; and

at least one crystal, wherein the plurality of capacitors, the at least one inductor, the at least one resistor, and the at least one crystal are mounted in the second surface areas of the first and second primary surfaces.

16. The small form factor USB Bluetooth dongle of claim 9 further comprises an over mold.

17. A small form factor universal serial bus (USB) Bluetooth dongle comprises:

a printed circuit board (PCB) having a first primary surface and a second primary surface;

a USB contact area on the first primary surface;

a radio frequency (RF) transceiver die on the second primary surface, wherein the RF transceiver is in accordance with Bluetooth;

an antenna fabricated on the second primary surface;

an external chip antenna;

an external metal antenna and

a USB metal shield at least partially encircling the USB contact area and the RF transceiver die.

18. The small form factor USB Bluetooth dongle of claim 17 further comprises:

a plastic filler encasing the RF transceiver die within the USB metal shield.

19. The small form factor USB Bluetooth dongle of claim 17 further comprises:

an electronically erasable programmable read only memory (EEPROM) mounted on the first surface adjacent to the USB contact area.

20. The small form factor USB Bluetooth dongle of claim 17 further comprises:

a ground plane on a surface of the PCB that is substantially parallel to the second primary surface, wherein the ground plane is radially aligned with the antenna on the second primary surface.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047196 FRAME: 0097. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048555/0510 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0097 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2004
From: KOCHIS, CRAIG ALAN; RAMSTHALER, THOMAS HERBERT
To: BROADCOM CORPORATION
Reel/Frame 015794/0462 →