Substrate treating apparatus
View Patent ↗A substrate treating apparatus is capable of promptly heating substrates after exposure, and avoiding an adverse thermal influence on an exposing apparatus. A developing block includes heating modules for heating exposed substrates. An interface block is interposed between the heating modules and the exposing apparatus to isolate the exposing apparatus from the thermal influence of the heating modules. The interface block has a transport mechanism for transporting the substrates to the heating modules, whereby the exposed substrates are promptly transferred to the heating modules.
1. A substrate treating apparatus for performing a required treatment of substrates, comprising:
a main body of the treating apparatus including a developing section for developing the substrates; and
an interface section for transferring the substrates between said main body of the treating apparatus and an exposing apparatus which is an external apparatus;
wherein said developing section comprises developing modules, heat-treating modules, and a main transport mechanism for transferring the substrates to and from said developing modules and said heat-treating modules;
said heat-treating modules comprise heating modules for heating exposed substrates before development;
said heating modules are disposed in said main body of the treating apparatus, adjacent said interface section, and remote from said exposing apparatus, said heating modules including a heating plate for supporting and heating the substrates, cooling means for cooling heated substrates heated by said heating plate, a temporary substrate deposit for holding cooled substrate, and a local transport mechanism for exclusive use in transporting the substrates from said heating plate to said temporary substrate deposit; and
said interface section includes a substrate transport mechanism for transferring the substrates directly to said heating modules.
2. A substrate treating apparatus as defined in claim 1 , wherein said heating plate and said cooling means are arranged adjacent each other and in said main body of the treating apparatus.
3. A substrate treating apparatus for performing a required treatment of substrates, comprising:
a main body of the treating apparatus including a developing section for developing the substrates;
an interface section for transferring the substrates between said main body of the treating apparatus and an exposing apparatus which is an external apparatus;
heating modules for heating exposed substrates before development; and
cooling means for cooling the substrates heated by said heating modules;
wherein said heating modules are disposed in said main body of the treating apparatus, and
said heating modules includes a heating plate for supporting and heating the substrates, a temporary substrate deposit adjacent to said heating plate for holding cooled substrates, and a local transport mechanism for exclusive use in transporting the substrates from said heating plate to said temporary substrate deposit; and
wherein said interface section includes a substrate transport mechanism for transferring the substrates to said temporary substrate deposit in said heating modules and transferring the cooled substrates held on said temporary substrate deposit to said developing section.
4. A substrate treating apparatus as defined in claim 3 , wherein said cooling means is provided for said local transport mechanism.
5. A substrate treating apparatus as defined in claim 4 , wherein said local transport mechanism includes a holding plate, said cooling means being provided for said holding plate.
6. A substrate treating apparatus as defined in claim 3 , wherein said cooling means is provided for said temporary substrate deposit.
7. A substrate treating apparatus as defined in claim 3 , wherein said heating plate is enclosed in a housing defining an opening for allowing said local transport mechanism to load and unload the substrates on/from said heating plate, said opening being located in a side remote from a side accessed by a main transport mechanism for transporting the substrates to said developing modules included in said developing section.
8. A substrate treating apparatus as defined in claim 1 , wherein said interface section includes a feed buffer for temporarily storing the substrates to be exposed, when said exposing apparatus is incapable of accepting the substrates.
9. A substrate treating apparatus as defined in claim 1 , wherein said interface section includes a return buffer for temporarily storing the substrates heated and cooled by said heating modules after exposure, when said developing section is incapable of accepting the substrates.
10. A substrate treating apparatus for performing a required treatment of substrates, comprising:
a main body of the treating apparatus including a developing section for developing the substrates;
an interface section for transferring the substrates between said main body of the treating apparatus and an exposing apparatus which is an external apparatus;
heating modules for heating exposed substrates before development; and
cooling means for cooling the substrates heated by said heating modules;
wherein said heating modules are disposed in said main body of the treating apparatus, and said heating modules include a heating plate for supporting and heating the substrate, a temporary substrate deposit adjacent to said heating plate for holding cooled substrates, and a local transport mechanism for exclusive use in transporting the substrates from said heating plate to said temporary substrate deposit; and
wherein said interface section includes a feed buffer for temporarily storing the substrates to be exposed, when said exposing apparatus is incapable of accepting the substrates, a return buffer for temporarily storing the substrates heated and cooled by said heating modules after exposure, when said developing section is incapable of accepting the substrates, and two substrate transport mechanisms;
one of said substrate transport mechanisms included in said interface section is arranged at least to transfer the substrates to said heating modules and said return buffer; and
the other of said substrate transport mechanisms included in said interface section is arranged at least to transfer the substrates to said exposing apparatus and said feed buffer.
11. A substrate treating apparatus as defined in claim 3 , wherein said heating modules are disposed in said main body adjacent said interface section, and remote from said exposing apparatus, and said interface section includes a substrate transport mechanism for transferring the substrates directly to said heating modules.
12. A substrate treating apparatus as defined in claim 10 , wherein said heating modules are disposed in said main body adjacent said interface section, and remote from said exposing apparatus, and wherein one of said two substrate transport mechanisms included in said interface section transfers the substrates directly to said heating modules.