Compositions for the removal of organic and inorganic residues
View Patent ↗A composition and method using same for removing photoresist and/or processing residue from a substrate are described herein. In one aspect, there is provided a composition for removing residue consisting essentially of: an acidic buffer solution having an acid selected from a carboxylic acid or a polybasic acid and an ammonium salt of the acid in a molar ratio of acid to ammonium salt ranging from 10:1 to 1:10; an organic polar solvent that is miscible in all proportions in water; a fluoride, and water wherein the composition has a pH ranging from about 3 to about 7.
1. A composition for removing residue, the composition consisting of:
an acidic buffer solution having a weak acid selected from a carboxylic acid or a polybasic acid and an ammonium salt of the acid in a molar ratio of acid to ammonium salt ranging from 10:1 to 1:10;
tetrahydrofurfuryl alcohol;
a fluoride, wherein the fluoride is selected from the group consisting of: ammonium fluoride, tetramethyl ammonium fluoride, tetraethyl ammonium fluoride and mixtures thereof;
water; and
optionally, a corrosion inhibitor,
wherein the composition has a pH ranging from about 3 to about 7.
2. The composition of claim 1 employing the corrosion inhibitor.
3. The composition of claim 2 wherein the corrosion inhibitor is at least one selected from anthranilic acid, gallic acid, benzoic acid, malonic acid, maleic acid, fumaric acid, D,L-malic acid, isophthalic acid, phthalic acid, maleic anhydride, phthalic anhydride, catechol, pyrogallol, esters of gallic acid, benzotriazole, carboxybenzotriazole and mixtures thereof.
4. The composition of claim 2 wherein the corrosion inhibitor has a pKa of less than about 6.
5. The composition of claim 1 wherein the acid within the acidic buffer solution comprises acetic acid and wherein the ammonium salt within the acidic buffer solution comprises ammonium acetate.
6. The composition of claim 1 wherein the acid within the acidic buffer solution comprises phosphoric acid and wherein the ammonium salt within the acidic buffer solution comprises an ammonium salt of phosphoric acid.
7. The composition of claim 1 wherein the molar ratio is substantially 1:1.
8. A method of removing residue from a substrate, comprising the step of applying a composition according to claim 1 to the substrate at a temperature of from 20° C. to 80° C. for a period of time sufficient to remove the residue from the substrate.
9. The method as claimed in claim 8 , wherein the temperature is from 20° C. to 60° C.
10. A method for defining a pattern comprising:
coating a photoresist onto at least a portion of the substrate;
lithographically defining a pattern on the photoresist;
transferring the pattern onto at least a portion of the substrate; and
removing the photoresist, processing residue, and mixtures thereof by contacting the substrate with a composition according to claim 1 .