IP Library Granted Patent US 7,135,714
Granted Patent B2
US 7,135,714 · App. 10/947,631 · Granted Nov 14, 2006

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

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Quick Facts
Patent No.
US 7,135,714
App. No.
10/947,631
Granted
Nov 14, 2006
Kind
B2
Abstract

An InGaN active layer is formed on a sapphire substrate. A p-side electrode is formed on the InGaN active layer to supply an electric current to this InGaN active layer. The p-side electrode includes {circle around (1)} an Ni layer for forming an ohmic contact with a p-GaN layer, {circle around (2)} an Mo layer having a barrier function of preventing diffusion of impurities, {circle around (3)} an Al layer as a high-reflection electrode, {circle around (4)} a Ti layer having a barrier function, and {circle around (5)} an Au layer for improving the contact with a submount on a lead frame. The p-side electrode having this five-layered structure realizes an ohmic contact and high reflectance at the same time.

Claims (51)

1. A light emitting element comprising:

a substrate;

a light emitting layer formed on said substrate to emit light, wherein said light emitting layer includes a first semiconductor layer of a first conductivity type, an active layer formed on said first semiconductor layer to emit the light and a second semiconductor layer of a second conductivity type formed on said active layer;

a first electrode contacting said second semiconductor layer; and

a second electrode contacting said first semiconductor layer,

said first electrode comprising:

an ohmic-layer in ohmic contact with said second semiconductor layer;

a barrier layer formed on said ohmic layer;

a light reflecting layer formed on said first barrier layer;

a second barrier layer formed on said light reflecting layer; and

an overcoat electrode for mounting formed on said second barrier layer,

wherein each of said active layer and said second semiconductor layer has a square shape, said first electrode has a round shape, both of said active layer and said second semiconductor layer are located at a place which is above the center of said substrate such that a center line drawn vertically through said substrate will pass through said active layer and said second semiconductor layer, and said second electrode is located at an edge portion of said substrate.

2. The light emitting element according to claim 1 ,

wherein said ohmic layer comprises a metal including Pt.

3. The light emitting element according to claim 1 ,

wherein said light reflecting layer comprises a metal including Ag.

4. The light emitting element according to claim 1 ,

wherein said first barrier layer comprises a material different from that of said ohmic layer.

5. The light emitting element according to claim 1 ,

wherein said light reflecting layer comprises a material different from that of said overcoat electrode.

6. The light emitting element according to claim 1 ,

wherein said substrate is an insulating substrate.

7. The light emitting element according to claim 6 ,

wherein said substrate is made of a sapphire.

8. The light emitting element according to claim 1 ,

wherein said first semiconductor layer and said second semiconductor layer include Ga.

9. A light-emitting element comprising:

a substrate;

a light emitting layer formed on said substrate to emit light, wherein said light emitting layer includes a first semiconductor layer of a first conductivity type, an active layer formed on said first semiconductor layer to emit the lights and a second semiconductor layer of a second conductivity type formed on said active layer;

a first electrode contacting said second semiconductor layer; and

a second electrode contacting said first semiconductor layer,

said first electrode comprising:

an ohmic layer in ohmic contact with said second semiconductor layer;

a first barrier layer formed on said ohmic layer;

a light reflecting layer formed on said first barrier layer;

a second barrier layer formed on said light reflecting layer; and

an overcoat electrode for mounting formed on said second barrier layer, p 1 wherein each of said active layer, said second semiconductor layer and said first electrode has a round shape, both of said active layer and said second semiconductor layer are located at a place which is above the center of said substrate such that a center line drawn vertically through said substrate will pass through said active layer and said second semiconductor layer, and said second electrode having a constant width is located at an edge portion of said substrate.

10. The light emitting element according to claim 9 ,

wherein said ohmic layer comprises a metal including Pt.

11. The light emitting element according to claim 9 ,

wherein said light reflecting layer comprises a metal including Ag.

12. The light emitting element according to claim 9 ,

wherein said first barrier layer comprises a material different from that of said ohmic layer.

13. The light emitting element according to claim 9 ,

wherein said light reflecting layer comprises a material different from that of said overcoat electrode.

14. The light emitting element according to claim 9 ,

wherein said, substrate is an insulating substrate.

15. The light emitting element according to claim 14 ,

wherein said substrate is made of a sapphire.

16. The light emitting element according to claim 9 ,

wherein said first semiconductor layer and said second semiconductor layer include Ga.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2018
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 046986/0159 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2018
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 046364/0164 →