IP Library Granted Patent US 7,122,397
Granted Patent B2
US 7,122,397 · App. 10/948,567 · Granted Oct 17, 2006

Method for manufacturing CMOS image sensor

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Quick Facts
Patent No.
US 7,122,397
App. No.
10/948,567
Granted
Oct 17, 2006
Kind
B2
Abstract

A method for manufacturing a CMOS image sensor includes depositing a gate oxide film and polysilicon on a substrate, forming a gate electrode by patterning and etching the gate oxide layer and the polysilicon, wherein the polysilicon of the gate electrode extends to an active region of the substrate, forming spacers on the sidewalls of the gate electrode, forming a mask pattern having an opening over the active region, removing the spacers and the gate oxide layer thereunder in the active region, removing the mask pattern, depositing a protective layer on a pixel region of the substrate, and conducting a salicide formation process on the resulting structure.

Claims (14)

1. A method for fabricating a CMOS image sensor having an active region, comprising:

depositing a gate oxide film and polysilicon on a substrate;

forming a gate electrode by etching the gate oxide layer and the polysilicon, wherein the polysilicon of the gate electrode extends to the active region;

forming spacers on the sidewalls of the gate electrode;

forming a mask pattern having an opening over the active region;

removing the spacers and the gate oxide layer thereunder in the active region;

removing the mask pattern;

depositing a protective layer on a pixel region of the substrate; and

conducting a salicide formation process on the resulting structure.

2. The method as defined by claim 1 , wherein the spacers comprise SiN.

3. The method as defined by claim 1 , wherein the spacers are removed by wet-etching.

4. The method as defined by claim 1 , wherein the gate oxide layer under the spacers is removed by dry-etching.

5. The method as defined by claim 1 , wherein the protective layer comprises TEOS.

6. The method as defined by claim 1 , wherein the salicide formation process forms a salicide layer which connects the polysilicon of the gate electrode with the active region.

Assignments (6)
CHANGE OF NAME Recorded Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
MERGER AND CHANGE OF NAME Recorded Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
RE-RECORD TO REMOVE 10/476,499 PREVIOUSLY RECORDED ON REEL 017274 FRAME 0027. Recorded Aug 3, 2006
From: DONGBU ELECTRONICS CO. LTD.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 018150/0415 →
CHANGE OF NAME Recorded Jul 13, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 018099/0256 →
MERGER Recorded Nov 28, 2005
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017274/0027 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2004
From: LIM, KEUN HYUK
To: DONGBU ELECTRONICS CO. LTD.
Reel/Frame 015847/0889 →