Mounting structure for semiconductor parts and semiconductor device
To arrange semiconductor parts such as chip resistors and the like between a BGA and a mounting substrate, an interposes is disposed between the BGA and the mounting substrate for mounting the BGA thereon. The interposer serves to maintain the distance between the mounting substrate and the BGA to be just as large as or larger than the thickness of the semiconductor parts and to electrically connect solder balls of the BGA and electrically conductive patterns of the mounting substrate. The semiconductor parts are mounted on the mounting substrate before fixing the BGA 22 to the interposer.
1. A mounting structure for semiconductor parts comprising:
an interposer disposed between a ball grid array (BGA) and a mounting substrate for mounting the BGA thereon,
wherein balls formed on a lower surface of the BGA and electrically conductive patterns formed on an upper surface of the mounting substrate are electrically connected to each other by mounting pads formed on the interposer,
wherein at least some of the semiconductor parts are disposed between the BGA and the mounting substrate,
wherein said mounting pads are disposed along said interposer at positions corresponding to positions of said balls, and
wherein said solder resists are formed along said interposer at positions, adjacent to said mounting pads, other than those that correspond to the positions of said balls.
2. The mounting structure for semiconductor parts as set forth in claim 1 , wherein the interposer comprises a multilayer circuit board.
3. The mounting structure for semiconductor parts as set forth in claim 1 , wherein said interposer comprises a thickness equal to 0.2 mm or more.
4. The mounting structure for semiconductor parts as set forth in claim 1 ,
wherein said interposer comprises mounting pads formed along a top surface of said interposer and mounting pads formed along a bottom surface of said interposer, and
wherein said mounting pads formed along a top surface of said interposer and said mounting pads formed along a bottom surface of said interposer are electrically connected to one another.
5. The mounting structure for semiconductor parts as set forth in claim 1 , wherein said interposer is fixed to a surface of the mounting substrate.
6. The mounting structure for semiconductor parts as set forth in claim 1 , wherein a thickness of said interposer is sufficiently large to provide a space between the BGA and the mounting substrate, said space being no smaller than a thickness of the semiconductor parts.
7. The mounting structure for semiconductor parts as set forth in claim 1 , wherein a combined thickness of said interposer and the balls is at least as large as a thickness of the semiconductor parts.
8. The mounting structure for semiconductor parts as set forth in claim 1 , wherein said interposer comprises at least one of a multilayer thin board and a multilayer tape.
9. The semiconductor device according to claim 1 , wherein said mounting pads and said solder resists are alternately formed along a top surface and a bottom surface of said interposer.
10. A semiconductor device comprising:
an interposer between a ball grid array (BGA) and a mounting substrate for mounting the BGA thereon,
wherein balls formed on a lower surface of the BGA and electrically conductive patterns formed on an upper surface of the mounting substrate are electrically connected to each other by mounting pads formed on the interposer,
wherein semiconductor parts are disposed between the BGA and the mounting substrate,
wherein said mounting pads are disposed along said interposer at positions corresponding to positions of said balls, and
wherein said solder resists are formed along said interposer at positions, adjacent to said mounting pads, other than those that correspond to the positions of said balls.
11. The semiconductor device as set forth in claim 10 , wherein the interposer comprises a multilayer circuit board.
12. A semiconductor device comprising:
a ball grid array;
a mounting substrate, said mounting substrate being electrically connected to said ball grid array by at least one solder ball; and
an interposer disposed between said ball grid array and said mounting substrate, wherein said interposer comprises a thickness sufficient to provide a space for arranging semiconductor parts between said ball grid array and said mounting substrate,
wherein balls formed on a lower surface of the BGA and electrically conductive patterns formed on an upper surface of the mounting substrate are electrically connected to each other by mounting pads formed on the interposer,
wherein said semiconductor parts are disposed between the BGA and the mounting substrate,
wherein said mounting pads are disposed along said interposer at positions corresponding to positions of said balls, and
wherein said solder resists are formed along said interposer at positions, adjacent to said mounting pads, other than those that correspond to the positions of said balls.