IP Library Granted Patent US 7,221,002
Granted Patent B2
US 7,221,002 · App. 10/958,911 · Granted May 22, 2007

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

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Quick Facts
Patent No.
US 7,221,002
App. No.
10/958,911
Granted
May 22, 2007
Kind
B2
Abstract

An InGaN active layer is formed on a sapphire substrate. A p-side electrode is formed on the InGaN active layer to supply an electric current to this InGaN active layer. The p-side electrode includes {circle around (1)} an Ni layer for forming an ohmic contact with a p-GaN layer, {circle around (2)} an Mo layer having a barrier function of preventing diffusion of impurities, {circle around (3)} an Al layer as a high-reflection electrode, {circle around (4)} a Ti layer having a barrier function, and {circle around (5)} an Au layer for improving the contact with a submount on a lead frame. The p-side electrode having this five-layered structure realizes an ohmic contact and high reflectance at the same time.

Claims (13)

1. A light emitting element comprising:

a substrate;

a light emitting layer formed on said substrate to emit light, wherein said light emitting layer includes a first semiconductor layer of a first conductivity type, an active layer formed on said first semiconductor layer to emit the light and a second semiconductor layer of a second conductivity type formed on said active layer;

a first electrode contacting said second semiconductor layer;

a second electrode contacting said substrate and being only located at a place which is below the center of the light emitting layer, such that a center line drawn vertically through the light emitting layer will pass through the second electrode; and

a light reflecting layer contacting said substrate and being only located at a place which is along an edge of said substrate.

2. The light emitting element according to claim 1 , wherein an area of said light reflecting layer is larger than that of said second electrode.

3. The light emitting element according to claim 1 , wherein said substrate is a conductive substrate.

4. The light emitting element according to claim 3 , wherein said substrate includes Ga.

5. The light emitting element according to claim 1 , wherein said first semiconductor layer and said second semiconductor layer include Ga.

6. The light emitting element according to claim 1 , wherein said first electrode is located at a place except a place which is above the center of said substrate.

7. The light emitting element according to claim 1 , further comprising a current limiting layer formed on said substrate, wherein said current limiting layer is located at a place except a place at which said light emitting layer is formed.

8. The light emitting element according to claim 7 , wherein said light reflecting layer is located at a place which is below the current limiting layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2018
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 046986/0159 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2018
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 046364/0164 →