Method for producing semiconductor device and semiconductor device
The method of producing a semiconductor device in which chips are resin-molded, including steps of: preparing frames having front and back surfaces and die pads; preparing an insulation resin sheet having a first and a second surfaces; preparing a resin-sealing metal mold having cap pins; mounting the resin sheet inside the resin-sealing metal mold in such a manner that the second surface of the resin sheet contacts an inner bottom surface of the resin-sealing metal mold; mounting power chips on the surfaces of the die pads; positioning the frames on the first surface of the resin sheet in such a manner that the back surfaces of the die pads contact the first surface of the resin sheet; pressing the die pads toward the resin sheet using the cap pins and fixing the die pads; injecting a sealing resin in the resin-sealing metal mold and hardening the sealing resin; and removing the semiconductor device in which the power chips are molded with the sealing resin out from the resin-sealing metal mold. The resin sheet may include a metal foil which is disposed to the second surface.
1. A semiconductor device in which chips are resin-molded, comprising:
frames having front and back surfaces and die pads;
power chips mounted on the surfaces of the die pads;
an insulation resin sheet having a first and a second surfaces which are opposed against each other, the resin sheet being disposed such that the back surfaces of the die pads contact the first surface of the resin sheet; and
a mold resin applied on the first surface of the resin sheet so as to seal up the power chips,
wherein on the front surface of the mold resin opposed against the back surface of the mold resin in which the resin sheet is exposed, there are dents at the locations where there used to be cap pins which have been pulled out.
2. The semiconductor device of claim 1 , wherein the dents are filled with a resin.
3. A semiconductor device in which chips are resin-molded, comprising:
frames having front and back surfaces and die pads;
power chips mounted on the surfaces of the die pads;
an insulation resin sheet having a first and a second surfaces which are opposed against each other, the resin sheet being disposed such that the back surfaces of the die pads contact the first surface of the resin sheet; and
a mold resin applied on the first surface of the resin sheet so as to seal up the power chips,
wherein on the front surface of the mold resin opposed against the back surface of the mold resin in which the resin sheet is exposed, there are projections at the locations where there used to be cap pins which have been pulled out.
4. A semiconductor device in which chips are resin-molded, comprising:
frames having front and back surfaces and die pads;
power chips mounted on the surfaces of the die pads;
an insulation resin sheet having a first and a second surfaces which are opposed against each other, the resin sheet being disposed such that the back surfaces of the die pads contact the first surface of the resin sheet; and
a mold resin applied on the first surface of the resin sheet so as to seal up the power chips,
wherein the die pads include pin pressing sections which stick out from the die pads.