Formation of circuitry with modification of feature height
A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.
1. A connection component for mounting a microelectronic element, said connection component comprising:
(a) a dielectric layer having an upwardly-facing inside surface and a downwardly-facing outside surface;
(b) electrically conductive traces extending on said dielectric layer remote from said outside surface;
(c) electrically conductive posts extending from said traces through said dielectric layer and projecting downwardly by post projection distances beyond said outside surface of said dielectric layer, wherein each post has a bottom surface joined to each trace, a top surface remote from said bottom surface, and an edge surface connecting said top and bottom surfaces; and
(d) electrically conductive pads extending from said traces through said dielectric layer and projecting downwardly by pad projection distances beyond said outside surface of said dielectric layer, said pad projection distances being less than said post projection distances, at least some of said pads being electrically connected to at least some of said posts by at least some of said traces.
2. A component as claimed in claim 1 wherein said posts are adapted for solder-bonding to a circuit panel.
3. A component as claimed in claim 1 wherein said traces extend on said inside surface of said dielectric layer.
4. A component as claimed in claim 1 wherein said pads have downwardly facing surfaces, said pads including a first metal and a layer of a second metal covering said surfaces.
5. A component as claimed in claim 1 wherein said pads have downwardly facing surfaces, said surfaces of said pads being substantially flat.
6. A component as claimed in claim 1 wherein said edge surface circumscribes said top surface and defines a width of said top surface bounded by said edge surface, wherein top surface is flat throughout said width of said top surface.
7. A component as claimed in claim 1 wherein said bottom surface of each said post defines a greatest width of said post.
8. A connection component for mounting a microelectronic element, said connection component comprising:
(a) a dielectric layer having an upwardly-facing inside surface and a downwardly-facing outside surface;
(b) electrically conductive traces extending on said dielectric layer remote from said outside surface;
(c) electrically conductive posts extending from said traces through said dielectric layer and projecting downwardly by post projection distances beyond said outside surface of said dielectric layer; and
(d) electrically conductive pads extending from said traces through said dielectric layer and projecting downwardly by pad projection distances beyond said outside surface of said dielectric layer, said pad projection distances being less than said post projection distances, at least some of said pads being electrically connected to at least some of said posts by at least some of said traces, wherein said posts and said pads have at least essentially the same composition and consist essentially of a solid metal.
9. A component as claimed in claim 8 wherein said post projection distances are substantially uniform and said pad projection distances are substantially uniform.
10. A component as claimed in claim 8 wherein said post projection distances are about 300 μm or less and said post projection distances exceed said pad projection distances by at least 25 μm.
11. A component as claimed in claim 8 wherein said dielectric layer has a plurality of edges and edge regions adjacent said edges, at least some of said pads projecting through a first one of said edge regions adjacent a first one of said edges.
12. A packaged microelectronic element comprising a component as claimed in claim 11 and a microelectronic element having a front face, said dielectric layer overlying a portion of said front face with said inside surface of said dielectric layer facing upwardly toward said front face, a first contact region of said front face projecting outwardly beyond said first edge of said dielectric layer, said microelectronic element having contacts exposed at said front face in said first contact region, the packaged element further including elongated leads extending between at least some of said contacts and at least some of said pads.
13. A packaged microelectronic element as claimed in claim 12 wherein said dielectric layer has a second edge opposite from said first edge and said microelectronic element includes a second edge region adjacent said second edge, wherein said front face of said microelectronic element includes a second contact region projecting outwardly beyond said second edge, said pads including second-edge pads projecting through said second edge region, said microelectronic element having second-region contacts exposed at said front surface in said second contact region, the packaged microelectronic element further comprising elongated second-edge leads extending from at least some of said second-region contacts to at least some of said second-edge pads.
14. A packaged microelectronic element as claimed in claim 13 wherein said elongated leads are wire bonds.
15. A packaged microelectronic element as claimed in claim 12 wherein said elongated leads are wire bonds.
16. A component as claimed in claim 8 wherein said dielectric layer has an elongated slot extending through it, said dielectric layer defining a pair of slot edge regions on opposite sides of said slot, said pads including slot-edge pads projecting through at least one of said slot edge regions.
17. A packaged microelectronic element comprising a component as claimed in claim 16 and a microelectronic element having a front face, said dielectric layer overlying a portion of said front face with said inside surface of said dielectric layer facing upwardly toward said front face, said microelectronic element having contacts exposed at said front face and aligned with said slot, the packaged microelectronic element further comprising elongated slot leads extending through said slot from at least some of said contacts to at least some of said slot-edge pads.
18. A packaged microelectronic element as claimed in claim 17 wherein said elongated leads are wire bonds.
19. A component as claimed in claim 8 wherein said posts and said pads consist essentially of copper.
20. A component as claimed in claim 8 wherein said posts have frustum shape.
21. A component as claimed in claim 8 wherein said posts have cooling tower shape.