Resin-encapsulated semiconductor apparatus and process for its fabrication
View Patent ↗The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed of a polyimide. The present invention also provides a process for fabricating a resin-encapsulated semiconductor apparatus, comprising the steps of forming a film of a polyimide precursor composition on the surface of a semiconductor device having a ferroelectric film; heat-curing the polyimide precursor composition film to form a surface-protective film formed of a polyimide; and encapsulating, with an encapsulant resin, the semiconductor device on which the surface-protective film has been formed. The polyimide may preferably have a glass transition temperature of from 240° C. to 400° C. and a Young's modulus of from 2,600 MPa to 6 GPa. The curing may preferably be carried out at a temperature of from 230° C. to 300° C.
1. A resin-encapsulated semiconductor apparatus comprising:
a semiconductor device having a ferroelectric film and a device surface-protective film, and an encapsulant member comprising a resin for encapsulating the semiconductor device,
wherein
said ferroelectric film is a dielectric material having a perovskite crystalline structure, and said film forms a capacitor of said semiconductor film therewith,
a semiconductor device having said capacitor and a semiconductor device having a logical circuit are mounted on a lead frame in the same encapsulant member,
said surface-protective film covers an entire surface of said semiconductor device except a bonding pad portion and a scribe area thereof,
said bonding pad portion and said lead frame are connected through wire-bonding.
2. The resin-encapsulated semiconductor apparatus according to claim 1 , wherein said surface-protective film is made of polyimide.
3. The resin-encapsulated semiconductor apparatus according to claim 1 , wherein said surface-protective film has a glass transition temperature of from 240° C. to 400° C.
4. The resin-encapsulated semiconductor apparatus according to claim 1 , wherein said surface-protective film has a Young's modulus of from 2,600 MPa to 6 GPa.
5. The resin-encapsulated semiconductor apparatus according to claim 1 , wherein said surface-protective film has a glass transition temperature from 240° C. to 400° C. and a Young's modulus of from 2,600 MPa to 6 GPa.
6. The resin-encapsulated semiconductor apparatus according to claim 1 , wherein said encapsulant member contains a silica-containing epoxy resin.
7. A resin-encapsulated semiconductor apparatus comprising:
a semiconductor device having a ferroelectric film and a device surface-protective film, and an encapsulant member comprising a resin for encapsulating the semiconductor device,
wherein
said ferroelectric film is a dielectric material having a perovskite crystalline structure, and said film forms a capacitor of said semiconductor film therewith,
a semiconductor device having said capacitor and a semiconductor device having a logical circuit are mounted on a lead frame in the same encapsulant member.
8. The resin-encapsulated semiconductor apparatus according to claim 7 , wherein said surface-protective film covers an entire surface of said semiconductor device except a bonding pad portion and scribe area.
9. The resin-encapsulated semiconductor apparatus according to claim 8 , wherein the bonding pad portion is electrically connected to an external electric circuit via a conductive member that is connected to said bonding pad.
10. The resin-encapsulated semiconductor apparatus according to claim 7 , wherein said surface-protective film is a polyimide having characteristics of a glass transition temperature of from 240° C. to 400°C. and a Young's modulus of from 2,600 MPa to 6 GPa.