Patent Assignment
Reel/Frame 026109/0269
Merger
Recorded: 2011-03-25
Pages: 22
Assignor
RENESAS TECHNOLOGY CORP.
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Properties
(94)
Semiconductor Device Including Multi-Layer Conductive Thin Film of Polycrystalline Material
Patent:
5,444,302 →
Application:
08/168,506 →
Nonvolatile Semiconductor Memory Device
Patent:
5,844,842 →
Application:
08/249,899 →
Data Line Disturbance Free Memory Block Divided Flash Memory and Microcomputer Having Flash Memory Therein
Patent:
5,768,194 →
Application:
08/473,114 →
Data Line Disturbance Free Memory Block Divided Flash Memory and Microcomputer Having Flash Memory Therein
Patent:
5,581,503 →
Application:
08/520,721 →
Apparatus for Manufacturing a Semiconductor Device Having Conductive Thin Films
Patent:
5,683,515 →
Application:
08/534,118 →
Semiconductor Integrated Circuit Device and Microcomputer
Patent:
6,608,509 →
Application:
08/622,389 →
Semiconductor Apparatus Having Conductive Thin Films
Patent:
6,118,140 →
Application:
08/749,324 →
Data Line Disturbance Free Memory Block Divided Flash Memory and Microcomputer Having Flash Memory Therein
Patent:
6,026,020 →
Application:
08/788,198 →
Semiconductor Integrated Circuit Arrangement Fabrication Method
Patent:
5,874,013 →
Application:
08/857,167 →
Semiconductor Integrated Circuit Device
Patent:
6,140,686 →
Application:
08/979,947 →
Semiconductor Apparatus Having Conductive Thin Films and Manufacturing Apparatus Therefor
Patent:
6,043,142 →
Application:
08/985,179 →
A Semiconductor Integrated Circuit Device Having an Electrically Erasable and Programmable Nonvolatile Memory and a Built-in Processing Unit
Patent:
6,064,593 →
Application:
09/144,194 →
Semiconductor Device Having Redundancy Circuit
Patent:
5,966,336 →
Application:
09/144,258 →
Polishing Method
Patent:
6,117,775 →
Application:
09/182,438 →
Semiconductor Integrated Circuit Arrangement Fabrication Method
Patent:
5,962,347 →
Application:
09/188,371 →
Semiconductor Ic Device Having a Control Register for Designating Memory Blocks for Erasure
Patent:
6,130,836 →
Application:
09/414,170 →
Data Line Disturbance Free Memory Block Divided Flash Memory and Microcomputer Having Flash Memory Therein
Patent:
6,166,953 →
Application:
09/414,944 →
Semiconductor Intergrated Circuit Device and Microcomputer
Patent:
6,166,577 →
Application:
09/415,220 →
Data Line Disturbance Free Memory Block Divided Flash Memory and Microcomputer Having Flash Memory
Patent:
6,181,598 →
Application:
09/435,037 →
Phase Adjustor for Semiconductor Integrated Circuit
Semiconductor apparatus having conductive thin films
Patent:
6,346,731 →
Application:
09/499,898 →
Semiconductor Apparatus Having Conductive Thin Films and Manufacturing Apparatus Therefor
Patent:
6,468,845 →
Application:
09/536,642 →
Process for Treating Solid Surface and Substrate Surface
Patent:
6,537,461 →
Application:
09/556,319 →
Semiconductor integrated circuit arrangement fabrication method
Patent:
6,309,980 →
Application:
09/564,754 →
Polishing Method
Patent:
6,596,638 →
Application:
09/618,999 →
Semiconductor integrated circuit device and microcomputer
Patent:
6,388,483 →
Application:
09/688,234 →
Semiconductor Integrated Circuit Device
Patent:
6,404,232 →
Application:
09/696,283 →
Method of Erasing and Programming a Flash Memory in a Single-Chip Microcomputer Having a Processing Unit and Memory
Patent:
6,335,879 →
Application:
09/705,835 →
Data Line Disturbance Free Memory Block Divided Flash Memory and Microcomputer Having Flash Memory Therein
Semiconductor Integrated Circuit Device and Microcomputer
Semiconductor Integrated Circuit Device and Microcomputer
Semiconductor Device and Manufacturing Method Thereof
Manufacturing Method for Electronic Device
Manufacturing Method of Semiconductor Integrated Circuit Device
Dual Interface Ic Card
Patent:
6,955,300 →
Application:
10/643,947 →
Semiconductor Integrated Circuit Device
Output Buffer Circuit with Control Circuit for Modifying Supply Voltage and Transistor Size
Resin-Encapsulated Semiconductor Apparatus and Process for Its Fabrication
Method for Manufacturing Semiconductor Device
Method for Manufacturing Semiconductor Device
Method of Manufacturing Semiconductor Integrated Circuit Device Optical Mask Therefor, Its Manufacturing Method, and Mask Blanks
Nonvolatile Memory Device with Multi-Bit Memory Cells Having Plural Side Gates
Semiconductor Device and Production Method Thereof
Manufacturing Method of Semiconductor Substrate and Method and Apparatus for Inspecting Defects of Patterns of an Object to Be Inspected
Method of Manufacturing a Semiconductor Integrated Circuit Device Having a Plurality of Wiring Layers and Mask-Pattern Generation Method
Semiconductor Memory Device Using Vertical-Channel Transistors
A Data Processing Device Having a Central Processing Unit and Digital Signal Processing Unit
Method for Manufacturing Semiconductor Integrated Circuit Device
Semiconductor Integrated Circuit and Data Processing System
Semiconductor Integrated Circuit
Semiconductor Device and Method for Fabricating the Same
Method of Manufacturing a Semiconductor Package with Elevated Tub
Fabrication Method of Semiconductor Integrated Circuit Device
Power Amplifier Module
Method of Manufacturing a Semiconductor Device
Semiconductor Device
Semiconductor Integrated Circuit Device with Connections Formed Using a Conductor Embedded in a Contact Hole
Semiconductor Device and Its Production Process
Semiconductor Wafer, Semiconductor Chip, and Manufacturing Method of Semiconductor Device
Disk Drive and Computer
Method of manufacturing a semiconductor integrated circuit device
Semiconductor Device and Manufacturing Method
Semiconductor Integrated Circuit Device and a Method of Manufacturing the Same
Power Amplifier System and Mobile Communication Terminal Device
Method of Manufacturing Semiconductor Integrated Circuit Devices
Semiconductor Device and Manufacturing Method of That
Method of Making a Misfet Semiconductor Device Having a High Dielectric Constant Insulating Film with Tapered End Portions
Wireless Communication System
Semiconductor Integrated Circuit and Method of Manufacturing of Semiconductor Integrated Circuit
Non-Volatile Semiconductor Memory Device and Semiconductor Disk Device
Nonvolatile Semiconductor Memory Device
Semiconductor Integrated Circuit Device Having a Dummy Conductive Film and Method of Manufacturing the Same
Method of Manufacturing a Dual Gate Semiconductor Device with a Poly-Metal Electrode
Semiconductor Integrated Circuit Device
High Frequency Power Amplifier Module and Wireless Communication Apparatus
Semiconductor Integrated Circuit Device and Imaging System
Semiconductor Integrated Circuit Device, Memory Module, Storage Device and the Method for Repairing Semiconductor Integrated Circuit Device
Resin-Encapsulated Semiconductor Apparatus and Process for Its Fabrication
Power Amplifier Module
Semiconductor Integrated Circuit Device
Semiconductor Integrated Circuit Device, Memory Module, Storage Device and the Method for Repairing Semiconductor Integrated Circuit Device
Semiconductor Integrated Circuit Device
Semiconductor Memory Device Using Vertical-Channel Transistors
Resin-Encapsulated Semiconductor Apparatus and Process for Its Fabrication
Output Buffer Circuit with Control Circuit for Modifying Supply Voltage and Transistor Size
Semiconductor Device
Semiconductor Integrated Circuit Device, Memory Module, Storage Device and the Method for Repairing Semiconductor Integrated Circuit Device
Method for Manufacturing Semiconductor Device
Semiconductor Device
Manufacturing Method of Semiconductor Substrate and Method and Apparatus for Inspecting Defects of Patterns of an Object to Be Inspected
Semiconductor Intergrated Circuit and Data Processing System
Method of Manufacturing a Semiconductor Device
Semiconductor Integrated Circuit Device
Semiconductor Device and Power Supply Device Using the Same
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 2, 2010
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 024006/0641 →
Change of Name
Mar 2, 2010
From: HITACHI VLSI ENGINEERING CORPORATION
To: HITACHI ULSI ENGINEERING CORPORATION
Reel/Frame 024006/0661 →
Merger
Mar 2, 2010
From: HITACHI ULSI ENGINEERING CORPORATION
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 024016/0653 →
Assignment of Assignor's Interest
Aug 7, 2015
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 036280/0364 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →