Semiconductor device and power supply device using the same
View Patent ↗A semiconductor device capable of reducing an inductance is provided. In the semiconductor device in which a rectification MOSFET, a commutation MOSFET, and a driving IC that drives these MOSFETs are mounted on one package, the rectification MOSFET, a metal plate, and the commutation MOSFET are laminated. A current of a main circuit flows from a back surface of the package to a front surface thereof. The metal plate is connected to an output terminal via a wiring in the package. Wire bondings are used for wirings for connecting the driving IC, the rectification MOSFET, and the commutation MOSFET, all terminals being placed on the same plane. For this reason, the inductance becomes small and also a power source loss and a spike voltage are reduced.
1. A semiconductor device formed over one package and having a rectification MOSFET and a commutation MOSFET, the semiconductor device comprising:
a metal plate that laminates the rectification MOSFET and the commutation MOSFET;
an external connecting terminal to provide a gate drive for the rectification MOSFET; and
an external connecting terminal to provide a reference voltage for a driver that drives the rectification MOSFET,
wherein a first wire, which connects the external connecting terminal for the gate drive and a gate terminal of the rectification MOSFET, is provided adjoiningly to a second wire, which connects the external connecting terminal for the reference voltage and a portion with a same potential as the reference voltage of the driver that drives the rectification MOSFET.
2. The semiconductor device according to claim 1 ,
wherein a portion with a same potential as the reference voltage of rectification MOSFET has a same potential as that of a source electrode of the rectification MOSFET.
3. The semiconductor device according to claim 2 ,
wherein the portion with the same potential as the reference voltage of the rectification MOSFET has a same potential as that of a drain electrode of the communication MOSFET.
4. The semiconductor device according to claim 1 ,
wherein a portion with a same potential as the reference voltage of the rectification MOSFET has a same potential as that of the metal plate.
5. The semiconductor device according to claim 4 ,
wherein the portion with the same potential as the reference voltage of the rectification MOSFET has a same potential as that of a drain electrode of the commutation MOSFET.
6. The semiconductor device according to claim 1 ,
wherein the portion with the same potential as the reference voltage of the rectification MOSFET is a source electrode of the rectification MOSFET, and said second wire, which connects the external connecting terminal for the reference voltage and said source electrode of the rectification MOSFET.
7. The semiconductor device according to claim 6 ,
wherein said metal plate is arranged on said rectification MOSFET, and said commutation MOSFET is arranged on said metal plate.
8. A semiconductor device formed over one package and having a rectification MOSFET and a commutation MOSFET, the semiconductor device comprising:
a metal plate that laminates the rectification MOSFET and the commutation MOSFET;
an input voltage terminal which an input voltage is applied to and which is arranged at a first side of the package, and
an output voltage terminal which an output voltage is applied to and which is arranged at a second side of the package,
wherein said first side of the package and said second side of the package are on opposite sides of the package from one another,
wherein a gate terminal of the laminated rectification MOSFET is arranged on said first side of the package.
9. The semiconductor device according to claim 8 ,
wherein respective currents between each of the laminated rectification MOSFET and commutation MOSFET and the metal plate flow in a lamination direction.
10. The semiconductor device according to claim 8 , further comprising:
a ground voltage terminal which an ground voltage applied to and which is arranged at a third side of the package, and
wherein said third side of the package is vertically located relative to said first side of the package and said second side of the package.
11. The semiconductor device according to claim 9 ,
wherein said metal plate is arranged on said rectification MOSFET, and said commutation MOSFET is arranged on said metal plate.
12. A semiconductor device comprising:
a sealing member;
a rectification MOSFET having a first gate terminal, a first source terminal and a first drain terminal;
a commutation MOSFET having a second gate terminal, a second source terminal and a drain second terminal;
a metal plate;
a first bonding wire;
a second bonding wire;
a first external terminal connected to the first gate terminal of the rectification MOSFET via the first bonding wire; and
a second external terminal electrically connected to the metal plate via the second bonding wire,
wherein the rectification MOSFET, the commutation MOSFET, the metal plate the first bonding wire, and the second bonding wire are sealed by the sealing member;
wherein the metal plate, the rectification MOSFET and the commutation MOSFET are laminated, and
wherein the first bonding wire is provided adjoiningly to the second bonding wire.
13. The semiconductor device according to claim 12 ,
wherein the first source terminal and the first gate terminal are arranged on a front surface side of the rectification MOSFET, and the first drain terminal is arranged on a back surface side of the rectification MOSFET, and
wherein the second source terminal and the second gate terminal are arranged on a front surface side of the commutation MOSFET, and the second drain terminal is arranged on a back surface side of the commutation MOSFET.
14. The semiconductor device according to claim 12 ,
wherein the second bonding wire connects the second external terminal and the first source terminal of the rectification MOSFET.
15. The semiconductor device according to claim 12 ,
wherein the metal plate is arranged on a front surface of the rectification MOSFET, and the commutation MOSFET is arranged on the metal plate.
16. A semiconductor device formed over one package comprising:
a first MOSFET having a first gate terminal, a first source terminal and a first drain terminal;
a second MOSFET having a second gate terminal, a second source terminal and a second drain terminal;
a metal plate;
a power source terminal arranged at a first side of the package; and
an output terminal arranged at a second side of the package,
wherein the first side of the package and the second side of the package are on opposite sides of the package from one another,
wherein the metal plate, the first MOSFET and the second MOSFET are laminated,
wherein the first drain terminal of the first MOSFET is electrically connected to the power source terminal,
which the first source terminal of the first MOSFET and the second drain terminal of the second MOSFET are electrically connected to the output terminal, and
wherein the first gate terminal of the first MOSFET is arranged on the first side of the package.
17. The semiconductor device according to claim 16 ,
wherein the first source terminal and the first gate terminal are arranged on a front surface side of the first MOSFET, and the first drain terminal is arranged on a back surface side of the first MOSFET, and
wherein the second source terminal and the second gate terminal are arranged on a front surface side of the second MOSFET, and the second drain terminal is arranged on a back surface side of the second MOSFET.
18. The semiconductor device according to claim 16 ,
wherein the metal plate is arranged on the first MOSFET, and
the drain terminal of the second MOSFET is connected to the metal plate.
19. The semiconductor device according to claim 16 ,
wherein the first MOSFET is a rectification MOSFET, and the second MOSFET is a commutation MOSFET.
20. A semiconductor device configured to be used for being mounted on an electrical circuit board comprising:
a lead frame configured to be used for being mounted on the electrical circuit board;
a first MOSFET chip having a first terminal, a second terminal and a third terminal;
a second MOSFET chip having a fourth terminal, a fifth source terminal and a sixth terminal;
a metal plate connected to the second terminal of the first MOSFET chip and the sixth terminal of the second MOSFET chip;
a sealing member;
a first external terminal connected to the first terminal of the first MOSFET chip via the first bonding wire;
a second external terminal connected to the fourth terminal of the second MOSFET chip via the second bonding wire;
a third external terminal electrically connected to the metal plate;
a fourth external terminal connected to the second terminal of the first MOSFET chip via the third bonding wire; and
a fifth external terminal electrically connected to the fifth terminal of the second MOSFET chip,
wherein the first terminal is a gate terminal of the first MOSFET chip, and the fourth terminal is a gate terminal of the second MOSFET chip,
wherein the first MOSFET chip is arranged on the lead frame, the metal plate is arranged on the first MOSFET chip, and the second MOSFET chip is arranged on the metal plate, and
wherein the first MOSFET, the second MOSFET, the metal plate, the first bonding wire, the second bonding wire, and the third bonding wire are sealed by the sealing member.
21. The semiconductor device according to claim 20 ,
wherein the first MOSFET is a rectification MOSFET, and the second MOSFET is a commutation MOSFET.
22. The semiconductor device according to claim 20 ,
wherein the second terminal is a source terminal of the first MOSFET chip, the third terminal is a drain terminal of the first MOSFET chip, the fifth terminal is a source terminal of the second MOSFET chip, and the sixth terminal is a drain terminal of the second MOSFET chip.
23. The semiconductor device according to claim 20 ,
wherein the third external terminal is connected to the metal plate via a fourth bonding wire.
24. The semiconductor device according to claim 20 ,
wherein the fifth external terminal is connected to the fifth terminal of the second MOSFET chip via a fifth bonding wire.
25. The semiconductor device according to claim 20 ,
wherein the fifth external terminal is a ground terminal to be applied a ground potential for the second MOSFET chip.