IP Library Granted Patent US 7,338,857
Granted Patent B2
US 7,338,857 · App. 10/965,129 · Granted Mar 4, 2008

Increasing adherence of dielectrics to phase change materials

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Quick Facts
Patent No.
US 7,338,857
App. No.
10/965,129
Granted
Mar 4, 2008
Kind
B2
Abstract

A phase change material is formed over a dielectric material. An impurity is introduced into the dielectric to improve the adherence of said dielectric to said phase change material.

Claims (8)

1. A method comprising:

ion implanting a dielectric to improve the adherence of a chalcogenide to said dielectric; and

forming a chalcogenide over said dielectric.

2. A method according to claim 1 , wherein introducing includes implanting an impurity selected from the group consisting of: Si, As, Sb, Ge, B, In, Ti, P. Mo, and W.

3. A method according to claim 2 , including introducing silicon.

4. A method according to claim 3 , including introducing silicon into said dielectric at a concentration between 10 16 and 10 23 atoms/cm 3 .

5. The method of claim 1 including depositing a phase change material directly on said dielectric.

6. The method of claim 1 including forming a planar chalcogenide over said dielectric.

Assignments (2)
CHANGE OF NAME Recorded Jul 18, 2016
From: CARLOW INNOVATIONS, LLC
To: OVONYX MEMORY TECHNOLOGY, LLC
Reel/Frame 039379/0077 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2015
From: OVONYX, INC.
To: CARLOW INNOVATIONS LLC
Reel/Frame 037244/0954 →