Method and device for ensuring trandsducer bond line thickness
An apparatus and method for producing a substantially uniform bond line thickness by utilizing a crosshatch, grid pattern, or spacers of like patterns in a receptacle of a transducer housing. Certain embodiments include a housing configured to retain a transducer. The housing includes an annular wall and a receptacle adjacent to the wall. The receptacle has a member configured to allow radiation to pass through it. The member has a first surface and a second surface. The spacers on the first surface are configured in a grid pattern to maintain uniform spacing and a uniform bond line thickness between the transducer and the member. The bond line is further controlled by the depth of the spacers, which are configured to maintain a generally constant bond line thickness.
1. A housing configured to retain a transducer, the housing comprising:
a wall; and
a receptacle positioned adjacent to the wall, the receptacle having a member configured to pass ultrasonic energy therethrough, the member including at least three spacers defining a uniform planar surface, the spacers configured to maintain a substantially uniform bond line between the transducer and the member.
2. The housing of claim 1 , wherein the wall portion is annular.
3. The housing of claim 1 wherein each spacer is columnar.
4. The housing of claim 1 wherein each spacer is pyramidal.
5. The housing of claim 1 wherein each spacer is dome-like.
6. The housing of claim 1 wherein a thickness of the bond line is controlled by a height of the spacers.
7. The housing of claim 1 wherein the bond line has a substantially constant thickness.
8. The housing of claim 1 wherein the member includes a grid formed an a top surface of the member, the grid including grid openings, and further wherein each spacer is positioned in one of the grid openings.
9. A housing configured to retain a transducer, the housing comprising:
a wall; and
a receptacle positioned adjacent to the wall, the receptacle having a member configured to pass ultrasonic energy therethrough, the member including a grid configured to maintain a substantially uniform bond line between the transducer and the member.
10. The housing of claim 9 wherein the grid is configured to maintain a substantially uniform spacing between the transducer and the member.
11. The housing of claim 9 wherein a thickness of the bond line is continued by a depth of the grid.
12. A method of providing a uniform bond line in a housing for a transducer, the method comprising:
providing a spacer on a first surface of the housing wherein a first surface of the spacer defines a uniform planar surface;
pre-selecting a height of the spacer; and
disposing a predetermined amount of adhesive on the housing and the spacer wherein passage of ultrasonic energy through the housing is not adversely affected and further wherein the spacer is configured to maintain a substantially uniform bond line and spacing between a transducer and the first surface of the housing.
13. The method of claim 12 wherein a thickness of the bond line is controlled by the height of the spacer.
14. The method of claim 12 wherein the bond line has a substantially constant thickness.
15. The method of claim 12 wherein the spacer includes at least three columnar shaped protrusions.
16. The method of claim 12 wherein the spacer includes at least three pyramidal shaped protrusions.
17. The method of claim 12 wherein the spacer includes at least three dome-like protrusions.
18. The method of claim 12 wherein the spacer includes a grid defining grid openings for receiving the adhesive.
19. The method of claim 12 and further comprising forming a grid on the first surface of the housing, the grid including grid openings wherein the spacer is positioned in the grid openings.