Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
This invention relates to a capacitive/resistive device, which may be embedded within a layer of a printed wiring board. Embedding the device conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability. More specifically, the device, comprises a first metallic foil; a second metallic foil; a first electrode formed from the first metallic foil; a dielectric disposed over the first electrode, a resistor element formed on and adjacent to the dielectric; a conductive trace; and a second electrode formed from the second metallic foil and disposed over the dielectric and in electrical contact with the resistor element, wherein the dielectric is disposed between the first electrode and the second electrode and wherein said dielectric comprises an unfilled polymer of dielectric constant less than 4.0. This invention also relates to a method of making the device.
1. A capacitive/resistive device, comprising:
(i) a first metallic foil;
(ii) a second metallic foil;
(iii) a capacitor dielectric layer disposed over the first metallic foil;
(iv) a resistive layer disposed over the second metallic foil and adjacent to the capacitor dielectric layer;
(v) a first capacitor electrode formed from the first metallic foil;
(vi) a second capacitor electrode and a conductive trace formed from the second metallic foil;
wherein the first capacitor electrode, the second capacitor electrode, and the capacitor dielectric layer form a capacitor;
(vii) a resistor element formed from the resistive layer;
wherein the resistor element extends between the conductive trace and the second capacitor electrode to form a terminated resistor in series with the capacitor; and
wherein the first capacitor electrode, the second capacitor electrode, and the resistor element are formed by selective imaging and etching to form specific values of capacitance and resistance respectively to achieve a specific circuit impedance;
wherein the capacitor dielectric layer has a dielectric constant of less than 4.0; and
wherein the capacitor and the terminated resistor are embedded within at least two printed wiring board dielectric laminate layers.