Patent Assignment
Reel/Frame 037332/0273
Merger
Recorded: 2015-12-18
Pages: 11
Assignor
CDA PROCESSING LIMITED LIABILITY COMPANY
Executed: 2015-08-26
Assignee
CHEMTRON RESEARCH LLC
160 GREENTREE DRIVE, SUITE 101, DOVER, DELAWARE, 19904
Covered Properties
(28)
Method to Embed Thick Film Components
Thick-Film Dielectric and Conductive Compositions
Co-Fired Ceramic Capacitor and Method for Forming Ceramic Capacitors for Use in Printed Wiring Boards
Thick Film Capacitors, Embedding Thick-Film Capacitors Inside Printed Circuit Boards, and Methods of Forming Such Capacitors and Printed Circuit Boards
Capacitive/Resistive Devices, Organic Dielectric Laminates and Printed Wiring Boards Incorporating Such Devices, and Methods of Making Thereof
Capacitive/Resistive Devices and Printed Wiring Boards Incorporating Such Devices and Methods of Making Thereof
Capacitive/Resistive Devices, Organic Dielectric Laminates and Printed Wiring Boards Incorporating Such Devices, and Methods of Making Thereof
Thin Film Capacitors on Ceramic
Acceptor Doped Barium Titanate Based Thin Film Capacitors on Metal Foils and Methods of Making Thereof
Power Core Devices and Methods of Making Thereof
Power Core Devices
Thick Film Capacitors on Ceramic Interconnect Substrates
Power Core Devices
Method of Making Capacitive/Resistive Devices
Power Core Devices and Methods of Making Thereof
Methods for Integration of Thin-Film Capacitors into the Build-Up Layers of a Pwb
High-Capacitance Density Thin Film Dielectrics Having Columnar Grains Formed on Base-Metal Foils
Method of Making Thin-Film Capacitors on Metal Foil Using Thick Top Electrodes
Device and Method for Reducing Impedance
Screen-Printable Encapsulants Based on Soluble Polybenzoxazoles
Screen-Printable Encapsulants Based on Polyhydroxyamides That Thermally Convert to Polybenzoxazoles
Capacitive/Resistive Devices, Organic Dielectric Laminates and Printed Wiring Boards Incorporating Such Devices, and Methods of Making Thereof
Thin Film Capacitors on Metal Foils and Methods of Manufacturing Same
Glass Flux Assisted Sintering of Chemical Solution Deposited Thin Dielectric Films
Thin Film Capacitor and Method of Fabrication Thereof
Composite Organic Encapsulants
Methods of Embedding Thin-Film Capacitors into Semiconductor Packages Using Temporary Carrier Layers
Thin Film Capacitor and Method of Fabrication Thereof
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 4, 2003
From: FELTEN, JOHN JAMES
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 013566/0571 →
Assignment of Assignor's Interest
Jul 9, 2004
From: BORLAND, WILLIAM J.; RENOVALES, OLGA L.; JONES, ALTON BRUCE, III
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 014834/0886 →
Assignment of Assignor's Interest
Sep 15, 2004
From: BORLAND, WILLIAM J.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 015129/0249 →
Assignment of Assignor's Interest
Dec 3, 2004
From: BORLAND, WILLIAM J.; FERGUSON, SAUL; PYADA, HENA
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 015413/0227 →
Assignment of Assignor's Interest
Mar 10, 2005
From: BORLAND, WILLIAM J.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 015760/0065 →
Assignment of Assignor's Interest
May 4, 2005
From: HANG, KENNETH WARREN
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 015973/0102 →
Assignment of Assignor's Interest
Jun 7, 2005
From: BORLAND, WILLIAM J.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 016099/0648 →
Assignment of Assignor's Interest
Aug 23, 2005
From: SUH, SEIGI; BORLAND, WILLIAM J.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 016437/0973 →
Assignment of Assignor's Interest
Sep 6, 2005
From: BORLAND, WILLIAM J.; MCGREGOR, DAVID ROSS; COX, G. SIDNEY
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 016494/0249 →
Assignment of Assignor's Interest
Sep 6, 2005
From: BORLAND, WILLIAM J.; MCGREGOR, DAVID ROSS; COX, G. SIDNEY
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 016494/0247 →
Assignment of Assignor's Interest
Sep 6, 2005
From: MCGREGOR, DAVID ROSS
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 016494/0287 →
Assignment of Assignor's Interest
Mar 3, 2006
From: MCGREGOR, DAVID ROSS; AMEY, JR., DANIEL IRWIN; BANERJI, SOUNAK; BORLAND, WILLIAM J.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 017246/0777 →
Assignment of Assignor's Interest
Mar 3, 2006
From: AMEY, JR., DANIEL IRWIN; BANERJI, SOUNAK; BORLAND, WILLIAM J.; DIETZ, KARL HARTMANN
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 017246/0774 →
Assignment of Assignor's Interest
Mar 13, 2006
From: AMEY, JR., DANIEL IRWIN; BORLAND, WILLIAM J.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 017299/0857 →
Assignment of Assignor's Interest
Dec 28, 2006
From: BORLAND, WILLIAM J.; FERGUSON, SAUL
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 018687/0211 →
Assignment of Assignor's Interest
Jul 9, 2007
From: BORLAND, WILLIAM; AMEY, DANIEL IRWIN, JR.; DIETZ, KARL HARTMANN; PALANDUZ, CENGIZ AHMET
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 019526/0759 →
Assignment of Assignor's Interest
Aug 17, 2007
From: AMEY, DANIEL I.; BORLAND, WILLIAM
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 019708/0895 →
Assignment of Assignor's Interest
Aug 27, 2007
From: BAO, LIJIE; LI, ZHIGANG RICK; REARDON, DAMIEN F.; RYLEY, JAMES F.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 019748/0816 →
Assignment of Assignor's Interest
Jan 20, 2012
From: E.I DU PONT DE NEMOURS AND COMPANY
To: CDA PROCESSING LIMITED LIABILITY COMPANY
Reel/Frame 027568/0067 →
Assignment of Assignor's Interest
Jan 24, 2012
From: MCGREGOR, DAVID ROSS
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 027583/0365 →