Power core devices and methods of making thereof
A device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor wherein said embedded singulated capacitor comprises at least a first electrode and a second electrode and wherein said embedded singulated capacitor is positioned on the outer layer of the power core so that at least one Vcc (power) terminal and at least one Vss (ground) terminal of a semiconductor device can be directly connected to at least one first and at least one second electrode, respectively and wherein the first and second electrode of the singulated capacitor is interconnected to the first and second electrode respectively of an external planar capacitor embedded within a printed wiring motherboard.
1. A printed wiring board device comprising a power core having an outer layer, said power core comprising at least one embedded singulated capacitor layer containing multiple embedded singulated capacitors wherein said multiple embedded singulated capacitors each comprise at least a first embedded singulated capacitor electrode and a second embedded singulated capacitor electrode and wherein said multiple embedded singulated capacitors are positioned on said outer layer of said power core and wherein said first embedded singulated capacitor electrodes and said second embedded singulated capacitor electrodes of said multiple embedded singulated capacitors of said at least one embedded singulated capacitor layer are each directly connected to at least one Vcc (power) terminal and at least one Vss (ground) terminal, respectively, of a semiconductor device and wherein said first embedded singulated capacitor electrodes and said second embedded singulated capacitor electrodes of said multiple embedded singulated capacitors of said at least one embedded singulated capacitor layer are each interconnected to a first external planar capacitor electrode and a second external planar capacitor electrode, respectively, of an external planar capacitor embedded within a printed wiring motherboard on which said power core is placed and wherein said printed wiring motherboard serves to supply a charge to said multiple embedded singulated capacitors.
2. The printed wiring board device of claim 1 wherein said semiconductor device is a microprocessor.
3. The printed wiring board device of claim 1 wherein said power core is interconnected to at least one signal layer.
4. The printed wiring board device of any one of claims 1 through 3 wherein additional passive components are connected to and external to said power core.
5. The printed wiring board of claim 1 wherein the multiple embedded singulated capacitors of said at least one embedded singulated capacitor layer are each fired-on-foil ceramic capacitors.
6. A printed wiring board device comprising a power core having an outer layer, said power core comprising at least one embedded singulated capacitor layer containing multiple embedded singulated capacitors wherein said multiple embedded singulated capacitors each comprise at least a first embedded singulated capacitor electrode and a second embedded singulated capacitor electrode and wherein said multiple embedded singulated capacitors are positioned on said outer layer of said power core and wherein said first embedded singulated capacitor electrodes and said second embedded singulated capacitor electrodes of said multiple embedded singulated capacitors of said at least one embedded singulated capacitor layer are each directly connected to at least one Vcc (power) terminal and at least one Vss (ground) terminal, respectively, of a semiconductor device, and
wherein said first embedded singulated capacitor electrodes and said second embedded singulated capacitor electrodes of said multiple embedded singulated capacitors of said at least one embedded singulated capacitor layer are each interconnected to a first external planar capacitor electrode and a second external planar capacitor electrode, respectively, of an external planar capacitor embedded within a printed wiring motherboard on which said power core is placed, and wherein said printed wiring motherboard serves to supply a charge to said multiple embedded singulated capacitors, and wherein the printed wiring board device has a smaller area than the external planar capacitor to which the multiple embedded singulated capacitors of said at least one embedded singulated capacitor layer are each interconnected.