Methods for integration of thin-film capacitors into the build-up layers of a PWB
Provided herein are devices comprising a printed wiring board that comprise, singulated capacitors fabricated from known good, thin-film, fired-on-foil capacitors. Provided are methods of incorporating the singulated capacitors into the build-up layers of a printed wiring board to minimize impedance. The singulated capacitors have a pitch that allows each power and ground terminal of an IC to be directly connected to a power and ground electrode, respectively, of its own singulated capacitor. Using a feedstock of known good, fired-on-foil capacitors allows for improved PWB yield.
1. A method of making a device comprising a printed wiring board, the method comprising:
providing at least one foil structure having
two sides and comprising
a known good, thin-film, fired-on-foil capacitor comprising a dielectric layer and a second electrode layer having a footprint;
applying metal to a side of the foil structure containing the second electrode;
patterning a side of the foil structure not containing the second electrode to form a plurality of first electrodes;
laminating the patterned side of the foil structure to a build-up layer of a printed wiring board (PWB);
patterning the side of the foil structure containing the second electrode of the fired-on-foil capacitor to form a plurality of second electrodes within the footprint of the second electrode layer,
wherein the forming of the plurality of the first electrodes and of the plurality of the second electrodes forms a plurality of singulated capacitors of a certain size and pitch such that each electrodes is available to be directly attached to a terminal of an integrated circuit; and
wherein the plurality of singulated capacitors lies directly under and within an area of the integrated circuit.
2. The method of claim 1 , wherein each electrode of the singulated capacitors that is attached to a terminal of the integrated circuit is so attached by forming and plating a via that connects the electrode to the terminal of the integrated circuit.
3. The method of claim 1 , wherein the entire area of the dielectric layer is supported on the foil structure.
4. The method of claim 1 , wherein the patterned side of the foil structure not containing the fired-on-foil capacitor is laminated to other PWB layers, thereby creating a coreless multilayer structure either in a single lamination step wherein multiple layers are laminated together in unison, or in multiple lamination steps wherein each layer is laminated individually.
5. The method of claim 1 , further comprising:
testing the fired-on-foil capacitor to determine that the capacitor has the quality of characteristic of the capacitor.
6. The method of claim 5 , further comprising:
sorting the diced component derived from the known good, fired-on-foil property of the capacitor incorporating the diced component into the build-up layer according to its property of the capacitor.
7. The method of claim 1 , further comprising:
before patterning, applying a carrier film to the side of the foil structure containing a capacitor.
8. A method of making a device comprising a printed wiring board, the method comprising:
providing at least one foil structure having
two sides and comprising
a known good, thin-film, fired-on-foil capacitor comprising
a dielectric layer and
a second electrode layer having a footprint;
applying metal to a side of the foil structure containing the second electrode;
patterning a side of the foil structure not containing the second electrode to form a plurality of first electrodes;
dicing the foil structure to form known good, diced components, the known good, diced components comprising at least one fired-on-foil capacitor;
picking and placing onto a build-up layer of the printed wiring board (PWB) at least one diced component so that the patterned side of the foil structure contacts the build-up layer;
laminating at least one known good, diced component to the build-up layer;
patterning the side of the foil structure containing the second electrode of the fired-on foil capacitor to form a plurality of second electrodes within the footprint of the second electrode layer,
wherein the forming of the plurality of the first electrodes and of the plurality of the second electrodes forms a plurality of singulated capacitors of a certain size and pitch such that each electrodes is available to be directly attached to a terminal of an integrated circuit; and
wherein the plurality of singulated capacitors lies directly under and within an area of the integrated circuit.
9. The method of claim 8 , wherein each electrode of the singulated capacitors that is attached to a terminal of the integrated circuit is so attached by forming and plating a via that connects the electrode to the terminal of the integrated circuit.
10. The method of claim 8 , wherein the entire area of the dielectric layer is supported on the foul structure.
11. The method of claim 8 , wherein the patterned side of the foil structure not containing the fired-on-foil capacitor is laminated to other PWB layers, thereby creating a coreless multilayer structure either in a single lamination step wherein multiple layers are laminated together in unison, or in multiple lamination steps wherein each layer is laminated individually.
12. The method of claim 11 , further comprising:
preventing assembly of components to the printed wiring board containing the known bad, fired-on-foil capacitor.
13. The method of claim 8 , further comprising:
testing the fired-on-foil capacitor to determine that the capacitor has the quality of characteristic of the capacitor.
14. The method of claim 8 , further comprising:
before patterning, applying a carrier film to the side of the foil structure containing a capacitor.