IP Library › Patent Application 10971813
Patent Application
App. No. 10/971,813

Electronic module

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Quick Facts
Patent No.
US None
App. No.
10/971,813
Abstract

An electronic module that includes a plurality of electrically conductive leads, an electrically conductive base plate, a first integrated circuit (IC) die, at least one material block and an electrically non-conductive overmold. The at least one material block functions to more closely match coefficient of thermal expansion (CTE) differences between components of the electronic module.

Claims (15)

1 . An electronic module, comprising:

at least one electrically conductive lead pin;

an electrically conductive base plate;

a first integrated circuit (IC) die attached to the base plate, wherein the IC die is electrically coupled to at least one the lead pin;

at least one material block positioned adjacent the die and attached to the base plate, wherein the material block has a coefficient of thermal expansion (CTE) that is greater than a CTE of the die and less than a CTE of the base plate; and

an electrically non-conductive overmold encapsulating the die, the material block, the base plate and a portion of the lead pin; wherein said die comprises silicon.

2 . The module of claim 1 , wherein the material block has about the same thickness as the die.

3 . An electronic module, comprising:

at least one conductive lead pin;

an electrically conductive base plate;

a first integrated circuit (IC) die attached to the base plate, wherein the IC die is electrically coupled to at least one the lead pin;

at least one material block positioned adjacent the die and attached to the base plate, wherein the material block has a coefficient of thermal expansion (CTE) that is greater than a CTE of the die and less than a CTE of the base plate;

an electrically non-conductive overmold encapsulating the die, the material block, the base plate and a portion of the lead pin;

a substrate including at least one conductive trace, wherein the substrate is attached to the base plate; and

at least one electronic component electrically coupled to the substrate, including at least a second IC die, wherein the second IC die is electrically coupled to at least a portion of the conductive trace of the substrate and the first IC die; and wherein said substrate comprising alumina.