Enhanced connection arrangement for co-planar vertical surface mounting of subassemblies on a mother board
View Patent ↗The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. Edge metallization of the subassembly board can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs.
1. A connected assembly of a system circuit board and a vertical mounted subassembly circuit board comprising:
a system circuit board having at least one major surface;
a subassembly circuit board having a pair of major surfaces, a first edge and an opposing second edge;
the subassembly circuit board vertically mounted on the system circuit board by a mounting arrangement comprising one or more metal lugs, each lug comprising a metal body having a generally planar base section for connecting to the major surface of the system board and a transverse section comprising a generally planar section substantially perpendicular to the base section for connecting to a major surface of the subassembly board;
the base section of each lug including one or more regions extending under the first edge of the subassembly circuit board; and
the first edge of the subassembly circuit board including one or more regions of metallization for connection with one or more lug regions extending under the edge to provide thermal or electrical connection.
2. The connected assembly of claim 1 wherein the first edge metallization provides thermal connection to the lug.
3. The connected assembly of claim 1 wherein the first edge metallization provides electrical connection to the lug.
4. The connected assembly of claim 1 wherein the subassembly includes one or more interior conductive layers and the first edge metallization provides connection between the interior layers and the lug.
5. The connected assembly of claim 1 wherein the first edge metallization comprises edge plating.
6. The connected assembly of claim 1 wherein the first edge metallization comprises one or more exposed conductive through holes.