Anti-reflective sidewall coated alternating phase shift mask and fabrication method

1. A method for fabricating a phase shift mask, comprising:

forming a trenched phase shift mask having portions of a light-blocking layer thereon;

forming a layer of anti-reflective material on the trenched phase shift mask and the portions of the light-blocking layer; and

removing the anti-reflective material on horizontal surfaces of the trenched phase shift mask and on the portions of the light-blocking layer.

2. The method of claim 1 wherein forming a trenched phase shift mask having portions of a light-blocking layer thereon further comprises forming opaque chromium regions on the trenched phase shift mask.

3. The method of claim 1 wherein forming a layer of anti-reflective material on the trenched phase shift mask and the portions of the light-blocking layer further comprises using a vapor deposition process to deposit a layer of chromium thereon.

4. The method of claim 1 wherein removing the anti-reflective material on horizontal surfaces of the trenched phase shift mask and the portions of the light-blocking layer further comprises anisotropically etching the layer of anti-reflective material to remove portions thereof in the central portions of the trenches and in the central portions of the untrenched substrate regions between the portions of the light-blocking layer.

5. The method of claim 1 wherein the anti-reflective material includes a material selected from chromium, molybdenum, aluminum, aluminum oxide, gold, silicon, silicon oxynitrides, silver, nickel, tungsten, an alloy thereof, a silicide thereof, a compound thereof, and a combination thereof.

6. A method for fabricating a phase shift mask, comprising:

forming a trenched phase shift mask having portions of a light-blocking layer thereon by:

providing a light-transparent substrate;

depositing a light-blocking layer on the light-transparent substrate;

forming a first mask on the light-blocking layer for etching the light-blocking layer;

etching the light-blocking layer not masked by the first mask to form the portions of the light-blocking layer;

removing the first mask;

forming a second mask on at least portions of the light-transparent substrate and the light-blocking layer for etching portions of the light-transparent substrate;

etching the light-transparent substrate not protected by the second mask to form trenches in the light-transparent substrate; and

removing the second mask;

forming a layer of anti-reflective material on the trenched phase shift mask and the portions of the light-blocking layer; and

removing the anti-reflective material on horizontal surfaces only of the trenched phase shift mask and of the portions of the light-blocking layer but not from vertical surfaces thereof.

7. The method of claim 6 wherein forming a trenched phase shift mask having portions of a light-blocking layer thereon further comprises forming opaque chromium regions on the trenched phase shift mask.

8. The method of claim 6 wherein forming a layer of anti-reflective material on the trenched phase shift mask and the portions of the light-blocking layer further comprises using a vapor deposition process to deposit a layer of chromium thereon.

9. The method of claim 6 wherein removing the anti-reflective material on horizontal surfaces only of the trenched phase shift mask and the portions of the light-blocking layer but not from vertical surfaces thereof further comprises anisotropically etching the layer of anti-reflective material to remove portions thereof in the central portions of the trenches and in the central portions of the untrenched substrate regions between the portions of the light-blocking layer without additional masking.

10. The method of claim 6 wherein the anti-reflective material includes a material selected from chromium, molybdenum, aluminum, aluminum oxide, gold, silicon, silicon oxynitrides, silver, nickel, tungsten, an alloy thereof, a silicide thereof, a compound thereof, and a combination thereof.

11. A phase shift mask, comprising:

a trenched phase shift mask having portions of a light-blocking layer thereon;

a layer of anti-reflective material on the trenched phase shift mask and the portions of the light-blocking layer; and

anti-reflective material on vertical surfaces of the trenched phase shift mask and of the portions of the light-blocking layer.

12. The mask of claim 11 wherein the trenched phase shift mask having portions of a light-blocking layer thereon further comprises opaque chromium regions on the trenched phase shift mask.

13. The mask of claim 11 wherein the layer of anti-reflective material on the trenched phase shift mask and the portions of the light-blocking layer further comprises a layer of vapor-deposited chromium thereon.

14. The mask of claim 11 wherein the anti-reflective material on vertical surfaces of the trenched phase shift mask and the portions of the light-blocking layer further comprises a layer of anti-reflective material anisotropically etched to remove portions thereof in the central portions of the trenches and in the central portions of the untrenched substrate regions between the portions of the light-blocking layer.

15. The mask of claim 11 wherein the anti-reflective material includes a material selected from chromium, molybdenum, aluminum, aluminum oxide, gold, silicon, silicon oxynitrides, silver, nickel, tungsten, an alloy thereof a silicide thereof, a compound thereof, and a combination thereof.

16. A phase shift mask, comprising:

a trenched phase shift mask having portions of a light-blocking layer thereon formed by:

providing a light-transparent substrate;

depositing a light-blocking layer on the light-transparent substrate;

forming a first mask on the light-blocking layer for etching the light-blocking layer;

etching the light-blocking layer not masked by the first mask to form the portions of the light-blocking layer;

removing the first mask;

forming a second mask on at least portions of the light-transparent substrate and the light-blocking layer for etching portions of the light-transparent substrate;

etching the light-transparent substrate not protected by the second mask to form trenches in the light-transparent substrate; and

removing the second mask;

a layer of anti-reflective material on the trenched phase shift mask and the portions of the light-blocking layer; and

anti-reflective material on vertical surfaces only of the trenched phase shift mask and of the portions of the light-blocking layer but not on horizontal surfaces thereof.

17. The mask of claim 16 wherein the trenched phase shift mask having portions of a light-blocking layer thereon further comprises opaque chromium regions on the trenched phase shift mask.

18. The mask of claim 16 wherein the layer of anti-reflective material on the trenched phase shift mask and the portions of the light-blocking layer further comprises a layer of vapor-deposited chromium thereon.

19. The mask of claim 16 wherein the anti-reflective material on vertical surfaces only of the trenched phase shift mask and the portions of the light-blocking layer but not on horizontal surfaces thereof further comprises a layer of anti-reflective material anisotropically etched to remove portions thereof in the central portions of the trenches and in the central portions of the untrenched substrate regions between the portions of the light-blocking layer without additional masking.

20. The mask of claim 16 wherein the anti-reflective material includes a material selected from chromium, molybdenum, aluminum, aluminum oxide, gold, silicon, silicon oxynitrides, silver, nickel, tungsten, an alloy thereof, a silicide thereof, a compound thereof, and a combination thereof.

21. A method of fabricating an integrated circuit comprising:

providing an integrated circuit substrate;

forming a light sensitive layer on the integrated circuit substrate;

providing a phase shift mask further comprising:

a trenched phase shift mask having portions of a light-blocking layer thereon;

a layer of anti-reflective material on the trenched phase shift mask and the portions of the light-blocking layer; and

anti-reflective material on vertical surfaces of the trenched phase shift mask and of the portions of the light-blocking layer;

using the phase shift mask to form a plurality of patterns on the light sensitive layer; and

processing the semiconductor wafer to form integrated circuits thereon.

22. The method of claim 21 wherein the trenched phase shift mask having portions of a light-blocking layer thereon further comprises opaque chromium regions on the trenched phase shift mask.

23. A method of fabricating an integrated circuit die comprising:

providing a silicon wafer;

forming a photoresist on the silicon wafer;

providing a phase shift mask further comprising:

a trenched phase shift mask having portions of a light-blocking layer thereon;

a layer of anti-reflective material on the trenched phase shift mask and the portions of the light-blocking layer; and

anti-reflective material on vertical surfaces of the trenched phase shift mask and of the portions of the light-blocking layer;

exposing the photoresist to radiation through the phase shift mask to form patterns on the photoresist; and

processing the silicon wafer to form integrated circuits thereon.

24. The method of claim 23 wherein the trenched phase shift mask having portions of a light-blocking layer thereon further comprises opaque chromium regions on the trenched phase shift mask.