Method for fabricating chip package
View Patent ↗An integrated chip package structure and method of manufacturing the same is by adhering dies on a metal substrate and forming a thin-film circuit layer on top of the dies and the metal substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.
1. A chip packaging method comprising:
joining a die and a first preformed substrate;
after said joining said die and said first preformed substrate, thinning said die;
after said thinning said die, joining said die and a second preformed substrate;
after said joining said die and said second preformed substrate, removing said first preformed substrate from said die;
after said removing said first preformed substrate from said die, depositing a first patterned metal layer over said die; and
after said depositing said first patterned metal layer over said die, separating said second preformed substrate into multiple portions.
2. The method of claim 1 , wherein said first preformed substrate comprises an organic material.
3. The method of claim 1 , wherein said first preformed substrate comprises silicon.
4. The method of claim 1 , wherein said first preformed substrate comprises glass.
5. The method of claim 1 , wherein said first preformed substrate comprises metal.
6. The method of claim 1 , after said joining said die and said first preformed substrate, further comprising forming a polymer layer over said first preformed substrate, followed by said thinning said die, followed by joining said polymer layer and said second preformed substrate.
7. The method of claim 6 , after said joining said die and said second preformed substrate, further comprising removing said polymer layer from said second preformed substrate, followed by said depositing said first patterned metal layer over said die.
8. The method of claim 1 , wherein said depositing said first patterned metal layer over said die comprises electroplating.
9. The method of claim 1 , wherein said depositing said first patterned metal layer over said die comprises sputtering.
10. The method of claim 1 , wherein said depositing said first patterned metal layer over said die comprises electroless plating.
11. The method of claim 1 , wherein said depositing said first patterned metal layer over said die comprises depositing copper.
12. The method of claim 1 , after said depositing said first patterned metal layer over said die, further comprising forming an insulating layer on said first patterned metal layer, followed by said separating said second preformed substrate into multiple portions.
13. The method of claim 12 , after said forming said insulating layer on said first patterned metal layer, further comprising depositing a second patterned metal layer on said insulating layer, followed by said separating said second preformed substrate into multiple portions.
14. The method of claim 1 , after said removing said first preformed substrate from said die, further comprising forming an insulating layer over said die, followed by said depositing said first patterned metal layer over said insulating layer.
15. The method of claim 14 , wherein said forming said insulating layer over said die comprises curing.
16. The method of claim 14 , wherein said forming said insulating layer comprises grinding.
17. The method of claim 14 , wherein said forming said insulating layer over said die comprises etching.
18. The method of claim 14 , wherein said forming said insulating layer over said die comprises said forming said insulating layer comprising a first portion over said die and a second portion over said second preformed substrate but not over said die.
19. The method of claim 1 , wherein said depositing said first patterned metal layer over said die comprises said depositing said first patterned metal layer comprising a first portion over said die and a second portion over said second preformed substrate but not over said die.
20. The method of claim 1 , after said depositing said first patterned metal layer over said die, further comprising depositing multiple metal bumps on said first patterned metal layer, followed by said separating said second preformed substrate into multiple portions.
21. The method of claim 1 , after said removing said first preformed substrate from said die, further comprising forming a polymer layer over said second preformed substrate and around the sidewalls of said die, followed by said depositing said first patterned metal layer over said die and over said polymer layer.
22. The method of claim 21 , wherein said forming said polymer layer over said second preformed substrate and around the sidewalls of said die comprises curing.
23. The method of claim 21 , wherein said forming said polymer layer over said second preformed substrate and around the sidewalls of said die comprises grinding.
24. The method of claim 21 , wherein said forming said polymer layer over said second preformed substrate and around the sidewalls of said die comprises etching.
25. The method of claim 1 , wherein said separating said second preformed substrate into multiple portions comprises mechanical cutting.
26. The method of claim 1 , wherein said separating said second preformed substrate into multiple portions comprises laser cutting.
27. The method of claim 1 , wherein said thinning said die comprises grinding.
28. The method of claim 1 , wherein said second preformed substrate comprises metal.