Printed wiring board interposer sub-assembly and method
View Patent ↗The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
1. An electrical sub-assembly including a first area array device and a second area array device spaced from one another a minimum distance of about 3 mm, an interposer between two area array devices, the interposer having a first surface facing the first area array device and second surface facing the second area array device, holes extending there through between said first surface and said second surface of the interposer, a carefully controlled excess of a cured or hardened conductive paste filling each hole and forming a contact button projecting on each surface of the interposer and in physical contact with a contact point on the facing surface of each of the area array devices, said conductive paste forming an electrical connection between said first and said second area array devices, wherein the contact point comprises a contact pad and no more than one contact button in physical contact with the contact pad.
2. The electrical sub-assembly according to claim 1 wherein the conductive paste comprises a cited silver filled elastomeric compound.
3. The electrical sub-assembly according to claim 1 wherein the interposer is clamped between said first area array device and the second area array device.
4. The sub-assembly according to claim 1 wherein one of the area array devices is a printed wiring board.
5. A method of making an electrical sub-assembly comprising a first area array device and a second area array device spaced from one another a minimum distance of about 3 mm and an interposer between the two area array devices having a first surface facing the first area array device and a second surface facing the second area array device, comprising the steps of:
(a) providing holes extending through the interposer between said first surface and said second surface thereof;
(b) filling each hole with a carefully controlled excess of a cured or hardened conductive paste;
(c) forming a contact button projecting on each surface of the interposer for making physical contact with a contact points on the facing surfaces of each of the two area array devices, wherein the contact point comprises a contact pad and no more than one contact button is in physical contact with the contact pad; and
(d) said conductive paste forming an electrical connection between said first and said second area array devices.
6. The method according to claim 5 comprising the use of a conductive paste silver filled elastomeric compound as the paste.
7. The method according to claim 6 wherein the silver filled elastomeric paste is cured after the holes are filled.
8. The method according to claim 5 wherein the interposer is clamped between said upper area array device and lower area array device whereupon the contact button on each surface of the interposer is in electrical contact with contact points on the facing surfaces of the two area array devices.