IP Library Granted Patent US 7,361,292
Granted Patent B2
US 7,361,292 · App. 10/983,387 · Granted Apr 22, 2008

High modulus, nonconductive adhesive useful for installing vehicle windows

Assignee: Dow Global Technologies Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,361,292
App. No.
10/983,387
Granted
Apr 22, 2008
Kind
B2
Abstract

The invention is a composition comprising a) one or more isocyanate functional polyether based prepolymers containing one or more organic based polymers dispersed therein; b) one or more isocyanate functional polyester based prepolymers which is solid at 23° C.; c) one or more polyisocyanates having a nominal functionality of about 3 or greater; d) one or more conductive carbon blacks in an amount such that the composition has a dielectric constant of about 15 or less; and e) one or more catalysts for the reaction of isocyanate moieties with hydroxyl groups, wherein the composition demonstrates upon cure a modulus of 2.0 MPa or greater at 25° C. measured according to ASTM D4065; a dielectric constant of about 15 or less; a sag of an uncured sample of less than 2 mm, a press flow viscosity of about 20 to about 50 and a storage modulus of about 5.3×10 5 Pa or greater.

Claims (17)

1. A composition comprising:

a) from about 25 to about 55 percent of one or more isocyanate functional polyether based prepolymers containing one or more organic based polymers dispersed therein having a free isocyanate content of about 0.8 to about 2.2 percent by weight based on the weight of the prepolymer;

b) from about 0.5 to about 10 percent of one or more isocyanate functional polyester based prepolymers which is solid at 23° C.;

c) from about 1 to about 8 percent of one or more polyisocyanates having a nominal functionality of about 3 or greater;

d) from about 10 to about 18 percent of one or more conductive carbon blacks in an amount such that the composition has a dielectric constant of about 15 or less; and

e) from about 0.005 to about 2 percent one or more catalysts for the reaction of isocyanate moieties with hydroxyl groups;

wherein the percentages are based on the weight of the composition and the composition demonstrates upon cure a modulus of 2.0 MPa or greater at 25° C. measured according to ASTM D4065; a dielectric constant of about 15 or less; a sag of an uncured sample of less than 2 mm, a press flow viscosity of about 20 to about 50 and a storage modulus of about 5.3×10 5 Pa or greater.

2. A composition according to claim 1 wherein the isocyanate functional polyester prepolymer exhibits a melting point of about 50° C. or greater.

3. A composition according to claim 2 wherein the polyfunctional polyisocyanate is an oligomer or polymer based on hexamethylene diisocyanate or methylene diphenyl diisocyanate.

4. A composition according to claim 1 wherein the organic based polymer is a thermoplastic polymer, a rubber modified thermoplastic polymer or a polyurea.

5. A composition according to claim 4 wherein the organic based polymer is a rubber modified thermoplastic polymer.

6. A composition according to claim 1 wherein

a) the one or more isocyanate functional polyether based prepolymers are present in an amount of about 25 to about 55 percent;

b) the one or more isocyanate functional polyester based prepolymers are present in an amount of about 1 to about 5 percent;

c) one or more polyfunctional isocyanates are present in an amount of about 1 to about 8 percent;

d) one or more conductive carbon blacks are present in an amount of about 10 to about 18 percent; and

e) one or more catalysts for the reaction of isocyanate moieties with hydroxyl groups are present in an amount of about 0.1 to about 1.75 percent; wherein the percentages are based on the weight of the composition.

Assignments (2)
CHANGE OF NAME Recorded Jul 20, 2017
From: DOW GLOBAL TECHNOLOGIES INC.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 043273/0697 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2006
From: ZHOU, LIRONG
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 017306/0232 →
Continuity (1)
Related Publication 20060096694A1 · May 11, 2006