Semiconductor manufacturing apparatus and pattern formation method
View Patent ↗A semiconductor manufacturing apparatus includes a liquid supplying section for supplying a liquid onto a stage for holding a wafer on which a resist film is formed; an exposing section for irradiating the resist film with exposing light through a mask with the liquid provided on the resist film; and a removing part for removing, from the liquid, a gas included in the liquid. Thus, the liquid from which the gas has been removed is provided on the resist film, and therefore, foams included in the liquid or formed during the exposure can be removed. Accordingly, exposure abnormality such as diffraction abnormality can be prevented, resulting in forming a resist pattern in a good shape.
1. A pattern formation method comprising the steps of:
forming a resist film on a substrate;
irradiating selectively said resist film with exposing light with a liquid provided on said resist film; and
forming a resist pattern by developing said resist film after the pattern exposure,
wherein the step of performing pattern exposure includes a sub-step of removing a gas included in said liquid provided on said resist film, and
wherein the sub-step employs at least one of the following methods: a nitrogen dissolving method, a thermal degassing method, a nitrogen gas bubbling method, a film degassing method, a reducer adding method, or a reducing method.
2. The pattern formation method of claim 1 , wherein said liquid is composed of water or perfluoropolyether.
3. The pattern formation method of claim 1 , wherein said liquid includes an antifoaming agent.
4. The pattern formation method of claim 1 , wherein said exposing light is KrF excimer laser, ArF excimer laser, F 2 laser, Kr 2 laser, ArKr laser, Ar 2 laser or Xe 2 laser.
5. A pattern formation method comprising the steps of:
forming a resist film on a substrate;
irradiating selectively said resist film with exposing light with a liquid provided on said resist film; and
forming a resist pattern by developing said resist film after the pattern exposure,
wherein the step of performing pattern exposure includes a sub-step of supplying said liquid onto said resist film and collecting said liquid from on said resist film in such a manner that a flow rate and a flowing direction of said liquid caused on said resist film substantially accord with a movement rate and a moving direction of said stage.
6. The pattern formation method of claim 5 , further comprising a step of removing a gas from said liquid having been collected from on said resist film and providing, onto said resist film, said liquid from which said gas has been removed.
7. The pattern formation method of claim 5 , wherein said exposing light is KrF excimer laser, ArF excimer laser, F 2 laser, Kr 2 laser, ArKr laser, Ar 2 laser or Xe 2 laser.
8. A pattern formation method comprising the steps of:
forming a resist film on a substrate;
spraying a liquid to be stored in a bath;
irradiating selectively said resist film with exposing light with said stored liquid provided on said resist film; and
forming a resist pattern by developing said resist film after the irradiating.
9. The pattern formation method of claim 8 , wherein, in the step of spraying a liquid, said liquid is stored by spraying said liquid on another liquid previously stored in said bath.
10. The pattern formation method of claim 8 , wherein the step of spraying a liquid and the step of irradiating are executed in parallel.
11. The pattern formation method of claim 8 , wherein said exposing light is KrF excimer laser, ArF excimer laser, F 2 laser, Kr 2 laser, ArKr laser, Ar 2 laser or Xe 2 laser.