Non-volatile memory cell techniques

1. A non-volatile memory cell, comprising:

a node configured to store charge;

an electrically insulating first layer coupled between the node and a first voltage source;

an electrically insulating second layer coupled between the node and a second voltage source; and

a controller configured to adjust the first voltage source and the second voltage source to inject charged particles and to extract charged particles with respect to the node.

2. The cell according to claim 1

wherein the charged particles are extracted by tunneling through the electrically insulating first layer, and

wherein the charged particles are injected by tunneling through the electrically insulating first layer.

3. The cell according to claim 1

wherein the charged particles are extracted and injected by field-assisted tunneling through the electrically insulating first layer, or

wherein die charged particles are extracted and injected by field-assisted tunneling through the electrically insulating second layer.

4. The cell according to claim 1

wherein the electrically insulating first layer comprises a first oxide layer, and

wherein the electrically insulating second layer comprises a second oxide layer.

5. The cell according to claim 1

wherein the electrically insulating first layer is approximately a planar structure, or

wherein the electrically insulating second layer is approximately a planar structure.

6. The cell according to claim 1 comprising:

a bit line; and

a first transistor,

wherein the charge stored in the node generates a node voltage,

wherein the electrically insulating first layer forms a portion of the first transistor,

wherein the first transistor comprises a transistor terminal biased by the node voltage, and

wherein the first transistor provides an electrical path between the bit line and the first voltage source.

7. The cell according to claim 6 comprising:

a word line; and

a second transistor,

wherein the second transistor also provides the electrical path, and

wherein the second transistor comprises a conductive state that is controlled by the word line.

8. The cell according to claim 1

wherein the electrically insulating first layer is coupled to the node through a first semiconductor material, or

wherein the electrically insulating second layer is coupled to the node through a second semiconductor material.

9. The cell according to claim 8

wherein the first semiconductor material comprises a first transistor, and

wherein the second semiconductor material comprises a second transistor, the second transistor being larger than the first transistor.

10. The cell according to claim 9

wherein the first transistor comprises a first PMOS field effect transistor, and

wherein the second transistor comprises a second PMOS field effect transistor.

11. The cell according to claim 10 comprising:

a third NMOS field effect transistor configured to inject charge into the node via channel hot electron injection.

12. The cell according to claim 9

wherein the first transistor comprises an NMOS field effect transistor, and

wherein the second transistor comprises a PMOS field effect transistor.

13. The cell according to claim 12

wherein the NMOS field effect transistor is configured to provide channel hot electron injection to the node, and

wherein the NMOS field effect transistor is configured to provide channel hot electron extraction from the node.

14. The cell according to claim 9

wherein the charge of the node generates a node voltage,

wherein the cell comprises a bit line and a third transistor, and

wherein the third transistor comprises a conductive state controlled by the node voltage, and

wherein the third transistor is part of an electrical path between the bit line and the first voltage source.

15. The cell according to claim 14

wherein the cell comprises a word line and a fourth transistor,

wherein the fourth transistor is part of the electrical path, and

wherein the fourth transistor comprises a conductive state controlled by the word line.

16. The cell according to claim 1

wherein the electrically insulating first layer comprises a first MOS-generic, fabricated planar layer, and

wherein the electrically insulating second layer comprises a second MOS-generic, fabricated planar layer.

17. A method of adjusting charge on a node configured to store charge in a non-volatile memory cell, comprising:

capacitively coupling a first voltage to the node;

capacitively coupling a second voltage to the node, the capacitive coupling of the first voltage being less than the capacitive coupling of the second voltage so that charge is extracted from the node;

capacitively coupling a third voltage to the node; and

capacitively coupling a fourth voltage to the node, the capacitive coupling of the third voltage being less than the capacitive coupling of the fourth voltage so that charge is injected into the node.

18. The method according to claim 17

wherein the charge is extracted from the node by tunneling, and

wherein the charge is injected to the node by tunneling.

19. A non-volatile memory cell, comprising:

a node configured to store charge,

wherein a first voltage is coupled capacitively to the node,

wherein a second voltage is coupled capacitively to the node,

wherein a third voltage is coupled capacitively to the node,

wherein a fourth voltage is coupled capacitively to the node,

wherein charge is extracted via tunneling from the node if the capacitive coupling of the first voltage is less than the capacitive coupling of the second voltage, and

wherein charge is injected via tunneling into the node if the capacitive coupling of the third voltage is less than the capacitive coupling of the fourth voltage.

20. The non-volatile memory cell according to claim 19 comprising:

a controller that is configured to adjust the first voltage, the second voltage, the third voltage and the fourth voltage.