Semiconductor device
View Patent ↗Disclosed is a semiconductor device comprising a semiconductor substrate, a capacitor provided above the semiconductor substrate and including a bottom electrode, a top electrode, and a dielectric film provided between the bottom electrode and the top electrode, the bottom electrode comprising a first conductive film containing iridium, a second conductive film provided between the dielectric film and the first conductive film and formed of a noble metal film, a third conductive film provided between the dielectric film and the second conductive film and formed of a metal oxide film having a perovskite structure, and a diffusion prevention film provided between the first conductive film and the second conductive film and including at least one of a metal film and a metal oxide film, the diffusion prevention film preventing diffusion of iridium contained in the first conductive film.
1. A semiconductor device comprising:
a semiconductor substrate;
a capacitor provided above the semiconductor substrate and including a bottom electrode, a top electrode, and a dielectric film provided between the bottom electrode and the top electrode,
the bottom electrode comprising a first conductive film containing iridium, a second conductive film provided between the dielectric film and the first conductive film and formed of a noble metal film, a third conductive film provided between the dielectric film and the second conductive film and formed of a metal oxide film having a perovskite structure, and a diffusion prevention film provided between the first conductive film and the second conductive film and including at least one of a metal film and a metal oxide film, the diffusion prevention film preventing diffusion of iridium contained in the first conductive film.
2. The semiconductor device according to claim 1 , wherein the metal film included in the diffusion prevention film contains at least one of Ti, V, W, Zr, Co, Mg, Hf, Mo, Mn, Ta, Nb, Pb, and Al.
3. The semiconductor device according to claim 1 , wherein the metal oxide film included in the diffusion prevention film contains at least one of Ti, V, W, Zr, Co, Mg, Hf, Mo, Mn, Ta, Nb, Pb, Al, and Ru.
4. The semiconductor device according to claim 1 , wherein the first conductive film includes at least one of an iridium film and an iridium oxide film.
5. The semiconductor device according to claim 1 , wherein the second conductive film includes at least one of a platinum film and a ruthenium film.
6. The semiconductor device according to claim 1 , wherein the metal oxide film included in the third conductive film contains at least one of Ru, Co, and Ni.
7. The semiconductor device according to claim 1 , wherein the metal oxide film included in the third conductive film is selected from an SrRuO 3 film, an (La, Sr)CoO 3 film, a BaRuO 3 film, and an LaNiO 3 film.
8. The semiconductor device according to claim 1 , wherein the dielectric film includes a ferroelectric film.
9. The semiconductor device according to claim 8 , wherein the ferroelectric film is selected from a compound film having a perovskite structure and a compound film having a Bi aurivillius phase structure.
10. The semiconductor device according to claim 1 , further comprising a plug which is connected to the bottom electrode and on which the capacitor is formed.
11. The semiconductor device according to claim 10 , further comprising a transistor provided on the semiconductor substrate and electrically connected to the plug.