Semiconductor device and method for manufacturing the same
View Patent ↗After formation of a gate insulating film for a high voltage transistor on the entire surface, when removing the gate insulating film existing within a low voltage region, etching is not finished upon expose of an active region, but overetching is performed until the surface of an element isolation insulating film becomes lower by, for example, about 15 nm than the surface of the active region within the low voltage region. Then, a high-temperature rapid thermal hydrogen treatment is performed on the active region within the low voltage region. As a result of this, a natural oxide film is removed from the surface of the active region within the low voltage region, so that the flatness is increased and its corners are rounded.
1. A semiconductor device, comprising:
a semiconductor substrate;
an element isolation insulating film formed on a surface of said semiconductor substrate which defines a first active region, a surface of said element isolation insulating film being at a position lower than a surface of said first active region, and an edge portion of said first active region being rounded; and
a first field effect transistor formed within said first active region,
wherein a second active region is defined at a position separate from said first active region by said element isolation insulating film,
a second field effect transistor is formed within said second active region,
a gate insulating film of said second field effect transistor is thicker than a gate insulating film of said first field effect transistor, and
a step between the surface of said element isolation insulating film and a surface of said second active region is smaller than a step between the surface of said element isolation insulating film and the surface of said first active region.
2. The semiconductor device according to claim 1 , wherein said first field effect transistor has a gate insulating film with a thickness of 2 nm or less.
3. The semiconductor device according to claim 1 , wherein a step between the surface of said element isolation insulating film and the surface of said first active region ranges from 5 nm to 20 nm.
4. The semiconductor device according to claim 1 , wherein an edge portion of said second active region is rounded.